CSD95480RWJ

ACTIVE

70A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint

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CSD95410RRB ACTIVE 90-A peak continuous synchronous buck NexFET™ smart power stage Improved device current rating and efficiency

Product details

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VQFN-CLIP (RWJ) 41 30 mm² 6 x 5
  • 70-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 70-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95480RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


The CSD95480RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.


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Technical documentation

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* Data sheet CSD95480RWJ Synchronous Buck NexFET Smart Power Stage datasheet PDF | HTML 13 Jun 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD95480RWJ PSpice Transient Model

SLPM245.ZIP (20 KB) - PSpice Model
Simulation model

CSD95480RWJ TINA-TI Spice Model

SLPM246.ZIP (17 KB) - TINA-TI Spice Model
Reference designs

PMP21887 — High-current 360-A static / 600-A peak core PMBus voltage 12-phase reference design for ASICs

This reference design is a a 12-phase power management bus (PMBus) buck converter powering datacenter hardware accelerator, enterprise switch and router application-specific integrated circuit (ASIC) core rails. It provides 360 A of continuous current and 600 A of peak current at 0.85-V nominal (...)
Test report: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
VQFN-CLIP (RWJ) 41 Ultra Librarian

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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