CSD95485RWJ

ACTIVE

75A synchronous buck nexFET™ smart power stage in an industry standard footprint

A newer version of this product is available

open-in-new Compare alternates
Drop-in replacement with upgraded functionality to the compared device
CSD95410RRB ACTIVE 90-A peak continuous synchronous buck NexFET™ smart power stage Improved device current rating and efficiency

Product details

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VQFN-CLIP (RWJ) 41 30 mm² 6 x 5
  • 75-A continuous operating current capability
  • Over 95% system efficiency at 30 A
  • High-frequency operation (up to 1.25 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead time for shoot-through protection
  • High-density QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant – lead-free terminal plating
  • Halogen free
  • 75-A continuous operating current capability
  • Over 95% system efficiency at 30 A
  • High-frequency operation (up to 1.25 MHz)
  • Diode emulation function
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead time for shoot-through protection
  • High-density QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant – lead-free terminal plating
  • Halogen free

The CSD95485RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95485RWJ NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
CSD95480RWJ ACTIVE 70A Synchronous Buck NexFET™ Smart Power Stage in an Industry Standard Footprint Slightly lower efficiency

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet CSD95485RWJ Synchronous Buck NexFET™ Smart Power Stage SHORT datasheet 08 Aug 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
VQFN-CLIP (RWJ) 41 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos