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Inverting buffers & drivers

SN74AUC2G240

ACTIVE

2-ch, 0.8-V to 2.7-V high speed inverters with 3-state outputs

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Data sheet

SN74AUC2G240

ACTIVE
Data sheet Order now

Product details

Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 2 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 2 IOL (max) (mA) 9 IOH (max) (mA) -9 Supply current (max) (µA) 10 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DCT) 8 11.8 mm² 2.95 x 4 VSSOP (DCU) 8 6.2 mm² 2 x 3.1
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.8 ns at 1.8 V
  • Low Power Consumption, 10 µA at 1.8 V
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.8 ns at 1.8 V
  • Low Power Consumption, 10 µA at 1.8 V
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC2G240 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A input to the Y output. When OE is high, the outputs are in the high-impedance state.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.

This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC2G240 is designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

This device is organized as two 1-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A input to the Y output. When OE is high, the outputs are in the high-impedance state.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.
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Technical documentation

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Type Title Date
* Data sheet SN74AUC2G240 datasheet (Rev. C) 12 Jan 2007
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 Mar 2003
User guide AUC Data Book, January 2003 (Rev. A) 01 Jan 2003
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
More literature AUC Product Brochure (Rev. A) 18 Mar 2002

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

SN74AUC2G240 Behavioral SPICE Model

SCEM708.ZIP (7 KB) - PSpice Model
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Simulation model

SN74AUC2G240 IBIS Model (Rev. A)

SCEM390A.ZIP (68 KB) - IBIS Model
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Simulation model

SN74AUC2G240 PSpice Model

SCEM574.ZIP (63 KB) - PSpice Model
Download
Package Pins CAD symbols, footprints & 3D models
SSOP (DCT) 8 Ultra Librarian
VSSOP (DCU) 8 Ultra Librarian
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