Home Microcontrollers (MCUs) & processors Digital signal processors (DSPs)
Home
Microcontrollers (MCUs) & processors
Digital signal processors (DSPs)

TMS320C40

NOT RECOMMENDED FOR NEW DESIGNS

Digital Signal Processors

Order now
Data sheet
TMS320C40 is not recommended for new designs
This product continues to be available for existing customers. New designs should consider an alternate product.
open-in-new Compare alternates
Similar functionality to the compared device
TMS320C6747 ACTIVE Low power C674x floating-point DSP- 456MHz, PBGA This product is a newer generation of floating point DSPs with higher performance & improved connectivity options.

TMS320C40

NOT RECOMMENDED FOR NEW DESIGNS
Data sheet Order now

Product details

DSP (max) (MHz) 50, 60 Rating Military Operating temperature range (°C) to
DSP (max) (MHz) 50, 60 Rating Military Operating temperature range (°C) to
  • Highest Performance Floating-Point Digital Signal Processor (DSP)
    • '320C40-60:
      33-ns Instruction Cycle Time,
      330 MOPS, 60 MFLOPS,
      30 MIPS, 384M Bytes/s
    • '320C40-50:
      40-ns Instruction Cycle Time
    • '320C40-40:
      50-ns Instruction Cycle Time
  • Six Communications Ports
  • Six-Channel Direct Memory Access (DMA) Coprocessor
  • Single-Cycle Conversion to and From IEEE-754 Floating-Point Format
  • Single Cycle, 1/x, 1/
  • Source-Code Compatible With TMS320C3x
  • Single-Cycle 40-Bit Floating-Point,
    32-Bit Integer Multipliers
  • Twelve 40-Bit Registers, Eight Auxiliary Registers, 14 Control Registers, and Two Timers
  • IEEE 1149.1 (JTAG) Boundary Scan Compatible
  • Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers:
    • High Port-Data Rate of 120M Bytes/s ('C40-60) (Each Bus)
    • 16G-Byte Continuous Program/Data/Peripheral Address Space
    • Memory-Access Request for Fast, Intelligent Bus Arbitration
    • Separate Address-Bus, Data-Bus, and Control-Enable Pins
    • Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware
  • 325-Pin Ceramic Grid Array (GF Suffix)
  • Fabricated Using 0.72-um Enhanced Performance Implanted CMOS (EPICTM) Technology by Texas Instruments (TITM)
  • Software-Communication-Port Reset
  • NMI\ With Bus-Grant Feature
  • Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance
  • On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance
    • 512-Byte Instruction Cache
    • 8K Bytes of Single-Cycle Dual-Access Program or Data RAM
    • ROM-Based Boot Loader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories or One of the Communication Ports
  • IDLE2 Clock-Stop Power-Down Mode
  • 5-V Operation

    IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary-Scan Architecture
    EPIC and TI are trademarks of Texas Instruments Incorporated.
  • Highest Performance Floating-Point Digital Signal Processor (DSP)
    • '320C40-60:
      33-ns Instruction Cycle Time,
      330 MOPS, 60 MFLOPS,
      30 MIPS, 384M Bytes/s
    • '320C40-50:
      40-ns Instruction Cycle Time
    • '320C40-40:
      50-ns Instruction Cycle Time
  • Six Communications Ports
  • Six-Channel Direct Memory Access (DMA) Coprocessor
  • Single-Cycle Conversion to and From IEEE-754 Floating-Point Format
  • Single Cycle, 1/x, 1/
  • Source-Code Compatible With TMS320C3x
  • Single-Cycle 40-Bit Floating-Point,
    32-Bit Integer Multipliers
  • Twelve 40-Bit Registers, Eight Auxiliary Registers, 14 Control Registers, and Two Timers
  • IEEE 1149.1 (JTAG) Boundary Scan Compatible
  • Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers:
    • High Port-Data Rate of 120M Bytes/s ('C40-60) (Each Bus)
    • 16G-Byte Continuous Program/Data/Peripheral Address Space
    • Memory-Access Request for Fast, Intelligent Bus Arbitration
    • Separate Address-Bus, Data-Bus, and Control-Enable Pins
    • Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware
  • 325-Pin Ceramic Grid Array (GF Suffix)
  • Fabricated Using 0.72-um Enhanced Performance Implanted CMOS (EPICTM) Technology by Texas Instruments (TITM)
  • Software-Communication-Port Reset
  • NMI\ With Bus-Grant Feature
  • Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance
  • On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance
    • 512-Byte Instruction Cache
    • 8K Bytes of Single-Cycle Dual-Access Program or Data RAM
    • ROM-Based Boot Loader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories or One of the Communication Ports
  • IDLE2 Clock-Stop Power-Down Mode
  • 5-V Operation

    IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary-Scan Architecture
    EPIC and TI are trademarks of Texas Instruments Incorporated.

The '320C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-um, double-level metal CMOS technology. The '320C40 is a part of the fourth generation of DSPs from Texas Instruments and is designed primarily for parallel processing.

The '320C40 digital signal processors (DSPs) are 32-bit, floating-point processors manufactured in 0.72-um, double-level metal CMOS technology. The '320C40 is a part of the fourth generation of DSPs from Texas Instruments and is designed primarily for parallel processing.
filter Find other Digital signal processors (DSPs)
Download

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet Digital Signal Processor datasheet 01 Jan 1996

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location