Product details

Package name DFN-0603 (X2SON), DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 27 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 0.18 IEC 61000-4-2 contact (±V) 15000 IEC 61000-4-5 (A) 2.5 Features ESD Protection Clamping voltage (V) 7 Dynamic resistance (typ) 0.57 Interface type HDMI 1.4/1.3, HDMI 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN-0603 (X2SON), DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 27 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 1 IO capacitance (typ) (pF) 0.18 IEC 61000-4-2 contact (±V) 15000 IEC 61000-4-5 (A) 2.5 Features ESD Protection Clamping voltage (V) 7 Dynamic resistance (typ) 0.57 Interface type HDMI 1.4/1.3, HDMI 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 6.4 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
X1SON (DPY) 2 0.6 mm² 1 x 0.6 X2SON (DPL) 2 0.18 mm² 0.6 x 0.3
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±15-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • IO Capacitance:
    • 0.18 to 0.20 pF (Typical)
    • 0.20 to 0.23 pF (Maximum)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Ultra Low Leakage Current: 10-nA (Maximum)
  • Low ESD Clamping Voltage: 15 V at 16 A TLP
  • Low Insertion Loss: 26.9 GHz (–3 dB Bandwidth, DPL)
  • Supports High Speed Interfaces up to 20 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0201 and 0402 footprints
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±15-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • IO Capacitance:
    • 0.18 to 0.20 pF (Typical)
    • 0.20 to 0.23 pF (Maximum)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Ultra Low Leakage Current: 10-nA (Maximum)
  • Low ESD Clamping Voltage: 15 V at 16 A TLP
  • Low Insertion Loss: 26.9 GHz (–3 dB Bandwidth, DPL)
  • Supports High Speed Interfaces up to 20 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0201 and 0402 footprints

The TPD1E01B04 is a bidirectional TVS ESD protection diode array for USB Type-C and Thunderbolt 3 circuit protection. The TPD1E01B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.18 to 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and Thunderbolt 3. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04 is offered in the industry standard 0201 (DPL) package and 0402 (DPY) packages.

The TPD1E01B04 is a bidirectional TVS ESD protection diode array for USB Type-C and Thunderbolt 3 circuit protection. The TPD1E01B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.18 to 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and Thunderbolt 3. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04 is offered in the industry standard 0201 (DPL) package and 0402 (DPY) packages.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
TPD1E01B04-Q1 ACTIVE Automotive 0.2pF ±3.6V ESD protection diode in 0402 package for high-speed interfaces Automotive qualified version

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 9
Type Title Date
* Data sheet TPD1E01B04 1-Channel ESD Protection Diode for USB Type-C and Thunderbolt 3 datasheet (Rev. C) PDF | HTML 19 Dec 2016
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 Sep 2021
Technical article ESD fundamentals, part 4: ESD capacitance PDF | HTML 12 Feb 2018
Technical article USB Type-C™: Will your ESD solution protect the port? PDF | HTML 21 Nov 2016
Technical article The dangers of deep snap-back ESD circuit-protection diodes PDF | HTML 12 Sep 2016
Application note Picking ESD Diodes for Ultra High-Speed Data Lines 29 Jun 2016

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

TPD1E01B04 (DPL package) PSpice Transient Model

SLVMDK6.ZIP (85 KB) - PSpice Model
Simulation model

TPD1E01B04 (DPY package) PSpice Transient Model

SLVMDK7.ZIP (86 KB) - PSpice Model
Simulation model

TPD1E01B04 IBIS Model

SLVMBL8.ZIP (3 KB) - IBIS Model
Simulation model

TPD1E01B04 S-Parameter Model

SLVMBO2.ZIP (15 KB) - S-Parameter Model
Package Pins CAD symbols, footprints & 3D models
X1SON (DPY) 2 Ultra Librarian
X2SON (DPL) 2 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos