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TPS2HCS10-Q1

PREVIEW

Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI

Product details

Number of channels 2 Operating voltage (max) (V) 18 Operating voltage (min) (V) 6 Ron (typ) (mΩ) 11 Imax (A) 12 Current limit type Adjustable FET Internal Features Current sense output, Current sense/monitor, Programmable current limit, Thermal shutdown, Undervoltage Lock Out (UVLO) Operating temperature range (°C) -40 to 125 Function Adjustable current limit, Automotive load dump compatibility, Current monitoring, Inductive load compatibility, Inrush current control, Short circuit protection, Thermal shutdown Rating Automotive
Number of channels 2 Operating voltage (max) (V) 18 Operating voltage (min) (V) 6 Ron (typ) (mΩ) 11 Imax (A) 12 Current limit type Adjustable FET Internal Features Current sense output, Current sense/monitor, Programmable current limit, Thermal shutdown, Undervoltage Lock Out (UVLO) Operating temperature range (°C) -40 to 125 Function Adjustable current limit, Automotive load dump compatibility, Current monitoring, Inductive load compatibility, Inrush current control, Short circuit protection, Thermal shutdown Rating Automotive
HTSSOP (PWP) 16 32 mm² 5 x 6.4
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C5
    • Withstands 35-V load dump
  • Functional Safety-Compliant Development
    • Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
  • Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
  • Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
    • Protection against persistent overload condition
  • Improve system level reliability through SPI programmable adjustable overcurrent protection
    • Overcurrent protection threshold: 10 to 70 A
  • SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
  • Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
  • Robust integrated output protection:
    • Integrated thermal protection
    • Protection against short-to-ground
    • Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
    • Automatic shut off on loss of battery and ground
    • Integrated output clamp to demagnetize inductive loads
  • Digital sense output via SPI can be configured to measure:
    • Load current accurately with integrated ADC
    • Output or supply voltage, FET temperature
  • Provides full fault diagnostics through SPI interface and indication through FLT pin
    • Detection of open load and short-to-battery
  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C5
    • Withstands 35-V load dump
  • Functional Safety-Compliant Development
    • Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
  • Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
  • Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
    • Protection against persistent overload condition
  • Improve system level reliability through SPI programmable adjustable overcurrent protection
    • Overcurrent protection threshold: 10 to 70 A
  • SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
  • Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
  • Robust integrated output protection:
    • Integrated thermal protection
    • Protection against short-to-ground
    • Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
    • Automatic shut off on loss of battery and ground
    • Integrated output clamp to demagnetize inductive loads
  • Digital sense output via SPI can be configured to measure:
    • Load current accurately with integrated ADC
    • Output or supply voltage, FET temperature
  • Provides full fault diagnostics through SPI interface and indication through FLT pin
    • Detection of open load and short-to-battery

The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.

The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.

The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.

The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.

The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.

The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.

The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.

The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.

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Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

HSS-2HCS10EVM — TPS2HCS10-Q1 daughter card for smart fuse high-side switch

The HSS-2HCS10EVM is a daughter card designed to be used with the HSS-HCMOTHERBRDEVM. This daughter card shows the functionality of Texas Instruments' smart fuse portfolio.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

HSS-HCMOTHERBRDEVM — Smart fuse evaluation module

The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

HSS-HCS-BLANKEVM — Unpopulated evaluation module for smart fuse switch portfolio

The HSS-HCS-BLANKEVM is a daughtercard designed to be used with the HSS-HCMOTHERBRDEVM. This daughtercard shows the functionality of our smart fuse portfolio.
User guide: PDF | HTML
Not available on TI.com
Driver or library

HCS-SMARTFUSE-DRIVERS Simple C drivers and code examples for HCS smart fuse devices

Simple C drivers and code examples for HCS smart fuse devices
Supported products & hardware

Supported products & hardware

Products
High-side switches
TPS2HCS10-Q1 Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
Hardware development
Evaluation board
HSS-2HCS10EVM TPS2HCS10-Q1 daughter card for smart fuse high-side switch HSS-HCMOTHERBRDEVM Smart fuse evaluation module
GUI for evaluation module (EVM)

HSS-SMART-CONFIGURATOR Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches

This software allows the user to configure and monitor diagnostics for the HSS-HCMOTHERBRDEVM high-side switch evaluation module. Device settings, diagnostics, and configuration can be read, changed, and manipulated via this software.
Supported products & hardware

Supported products & hardware

Products
High-side switches
TPS2HCS10-Q1 Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
Hardware development
Evaluation board
HSS-HCMOTHERBRDEVM Smart fuse evaluation module HSS-2HCS10EVM TPS2HCS10-Q1 daughter card for smart fuse high-side switch
Support software

HCS-HEADER-FILES C Header files for smart fuse high-side switches with register definitions

C header files for smart-fuse high-side switches with register definitions
Supported products & hardware

Supported products & hardware

Products
High-side switches
TPS2HCS10-Q1 Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
Hardware development
Evaluation board
HSS-HCS-BLANKEVM Unpopulated evaluation module for smart fuse switch portfolio HSS-2HCS10EVM TPS2HCS10-Q1 daughter card for smart fuse high-side switch HSS-HCMOTHERBRDEVM Smart fuse evaluation module
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Reference designs

TIDA-020079 — Zone reference design

This reference design demonstrates key functions of next-generation zone control modules including power distribution, load actuation and in-vehicle networking. The design highlights functional safety-compliant PMIC and microcontroller (MCU) design, redundant power supply management with ideal (...)
Design guide: PDF
Package Pins CAD symbols, footprints & 3D models
HTSSOP (PWP) 16 Ultra Librarian

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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