TPS2HCS10-Q1
Automotive, dual-channel 10-mΩ smart high-side switch with I²T wire protection, low IQ mode and SPI
TPS2HCS10-Q1
- AEC-Q100 qualified for automotive applications
- Temperature grade 1: –40°C to 125°C
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- Withstands 35-V load dump
- Functional Safety-Compliant Development
- Documentation on safety mechanisms will be available at product release to aid ISO 26262 system design up to ASIL-B
- Dual-channel SPI controlled smart high-side switch with a typical 11-mΩ Rdson at 25°C FET
- Integrated wire-harness protection without MCU involvement and a SPI programmable fuse curve
- Protection against persistent overload condition
- Improve system level reliability through SPI programmable adjustable overcurrent protection
- Overcurrent protection threshold: 10 to 70 A
- SPI configurable capacitive charging mode to drive a wide range of capacitive input ECUs load current needs.
- Low quiescent current, low power ON-state to supply always-ON loads with automatic wake on load current increase with wake signal to MCU
- Robust integrated output protection:
- Integrated thermal protection
- Protection against short-to-ground
- Protection against reverse battery events including automatic switch on of FET with reverse supply voltage
- Automatic shut off on loss of battery and ground
- Integrated output clamp to demagnetize inductive loads
- Digital sense output via SPI can be configured to measure:
- Load current accurately with integrated ADC
- Output or supply voltage, FET temperature
- Provides full fault diagnostics through SPI interface and indication through FLT pin
- Detection of open load and short-to-battery
The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds. This allows sufficient flexibility to support loads that require large inrush currents, while providing improved protection. Further, the device integrates a programmable fuse profile (current versus time) that turns off the switch under persistent overload condition, thereby reducing the overhead on the MCU. These two features together allow optimization of the wire harness for any load profile with full protection.
The device supports a SPI-configurable capacitive charging mode for ECU loads in power distribution switch applications. The device also includes a low quiescent current ON-state that provides up to 800 mA of peak current while consuming about 10 µA of current.
The TPS2HCS10-Q1 device also provides a high accuracy digital current sense over SPI that allows for improved load diagnostics. By reporting load current and the channel output voltage and output FET temperature to a system MCU, the device enables diagnosis of switch and load failures.
The TPS2HCS10-Q1 is available in a HTSSOP package which allows for reduced PCB footprint.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | TPS2HCS10-Q1 11-mΩ, Automotive Dual-Channel, SPI Controlled High-Side Switch With Low Quiescent Current ON Mode and Integrated I2t Wire Protection datasheet | PDF | HTML | 24 Oct 2023 |
Application brief | Reducing System Bill of Materials and MCU Pin Requirements With SPI eFuse Switches (Rev. A) | PDF | HTML | 30 Sep 2024 | |
Application brief | New TPS2HCS10-Q1 Switch Solves Challenges to Smart Power Distribution in Zone Co | PDF | HTML | 01 Aug 2024 | |
Application note | Common Software Use Case Examples with TI Smart Fuse High-Side Switches (Rev. A) | PDF | HTML | 02 Jul 2024 | |
Technical article | eFuse 如何協助推動軟體定義車輛的區域架構革命 | PDF | HTML | 17 May 2024 | |
Technical article | eFuse가 소프트웨어 정의 차량의 영역 아키텍처 혁신을 이끄는 방법 | PDF | HTML | 16 May 2024 | |
Technical article | How eFuses are helping drive the zone architecture revolution for software-defined vehicles | PDF | HTML | 13 May 2024 | |
EVM User's guide | TPS2HCS10-Q1 Smart Fuse Evaluation Module User's Guide (Rev. B) | PDF | HTML | 24 Jan 2024 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
HSS-2HCS10EVM — TPS2HCS10-Q1 daughter card for smart fuse high-side switch
The HSS-2HCS10EVM is a daughter card designed to be used with the HSS-HCMOTHERBRDEVM. This daughter card shows the functionality of Texas Instruments' smart fuse portfolio.
HSS-HCMOTHERBRDEVM — Smart fuse evaluation module
The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a (...)
HSS-HCS-BLANKEVM — Unpopulated evaluation module for smart fuse switch portfolio
HSS-HCSRCPACKAGE — Source package for GUI and firmware of HSS-HCMOTHERBRDEVM
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
HSS-SMART-CONFIGURATOR — Configuration tool for the HSS-HCMOTHERBRDEVM and TI's smart fuse high-side switches
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
HCS-HEADER-FILES — C Header files for smart fuse high-side switches with register definitions
Supported products & hardware
Products
High-side switches
Hardware development
Evaluation board
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HTSSOP (PWP) | 16 | Ultra Librarian |
Ordering & quality
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- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
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