The TPSM560R6H power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The TPSM560R6H is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM560R6H an excellent device to power a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package.
The TPSM560R6H power module is a highly integrated 600-mA power solution that combines a 60-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses enhanced HotRod QFN technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The TPSM560R6H is a compact, easy-to-use power module with a wide adjustable output voltage range of 1.0 V to 16 V. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and temperature protections, making the TPSM560R6H an excellent device to power a wide range of applications. Space-constrained applications benefit from the 5.0-mm × 5.5-mm package.