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TS3USB30E

ACTIVE

High-Speed USB 2.0 1:2 Mux/Demux Switch With Single Enable and ESD Protection

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Data sheet

TS3USB30E

ACTIVE
Data sheet Order now

Product details

Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 900
Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 4.3 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 6000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 4.3 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 1 ESD HBM (typ) (kV) 8 Bandwidth (MHz) 900
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • VCC Operation at 3 V to 4.3 V
  • D+/D– Pins Tolerate up to 5.25 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II(1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND(2)
    • 15000-V Human-Body Model
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)
  • VCC Operation at 3 V to 4.3 V
  • D+/D– Pins Tolerate up to 5.25 V
  • 1.8-V Compatible Control-Pin Inputs
  • IOFF Supports Partial Power-Down-Mode
    Operation
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 µA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II(1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND(2)
    • 15000-V Human-Body Model
  • Packaged in 10-pin UQFN (1.4 mm × 1.8 mm)

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

The TS3USB30E is a high-bandwidth 1:2 switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs, or from two different hosts to one corresponding output. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB30E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
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Type Title Date
* Data sheet ESD-Protected, High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer/Demultiplexer Swit datasheet (Rev. F) 14 Aug 2015
Application note Passive Mux Selection Based On Bandwidth > Ron 11 Sep 2019
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 Jun 2018

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