Product details

Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 24 IOH (max) (mA) 0 Supply current (max) (µA) 40 Input type TTL-Compatible CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family ACT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 6 IOL (max) (mA) 24 IOH (max) (mA) 0 Supply current (max) (µA) 40 Input type TTL-Compatible CMOS Output type Open-drain Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 14 130.4652 mm² 19.56 x 6.67
  • Inputs are TTL-voltage compatible
  • Speed of bipolar F, AS, and S, with significantly reduced power consumption
  • Fanout to 15 F devices
  • SCR-latchup-resistant CMOS process and circuit design
  • Exceeds 2kV ESD protection per MIL-STD-883, method 3015
  • Inputs are TTL-voltage compatible
  • Speed of bipolar F, AS, and S, with significantly reduced power consumption
  • Fanout to 15 F devices
  • SCR-latchup-resistant CMOS process and circuit design
  • Exceeds 2kV ESD protection per MIL-STD-883, method 3015

The ’ACT05 devices contain six independent inverters.

The ’ACT05 devices contain six independent inverters.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 12
Type Title Date
* Data sheet CDx4ACT05 Hex Inverters With Open-Drain Outputs datasheet (Rev. E) PDF | HTML 01 Nov 2024
* SMD CD54ACT05 SMD 5962-90686 21 Jun 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 Apr 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
CDIP (J) 14 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos