CD40x7B CMOS analog multiplexers or demultiplexers are digitally controlled analog switches having low ON impedance, low OFF leakage current, and internal address decoding. When these devices are used as demultiplexers, the channel in or out terminals are the outputs and the common out or in terminals are the inputs. In addition, the ON resistance is relatively constant over the full input-signal range.
The CD4067B is a 16-channel multiplexer with four binary control inputs, A, B, C, D, and an inhibit input, arranged so that any combination of the inputs selects one switch.
A logic "1" present at the inhibit input turns all channels off.
The CD40x7B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR suffixes), and 24-lead thin shrink small-outline packages (P and PWR suffixes).
| Typ | Titel | Datum | ||
|---|---|---|---|---|
| * | Data sheet | CD40x7B CMOS Analog Multiplexers or Demultiplexers datasheet (Rev. D) | PDF | HTML | 09 Aug 2024 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 02 Jun 2022 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 01 Dez 2021 | |
| Selection guide | Logic Guide (Rev. AB) | 12 Jun 2017 | ||
| Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 02 Dez 2015 | ||
| User guide | LOGIC Pocket Data Book (Rev. B) | 16 Jan 2007 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 08 Jul 2004 | ||
| User guide | Signal Switch Data Book (Rev. A) | 14 Nov 2003 | ||
| Application note | Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics | 03 Dez 2001 |
Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| SOIC (DW) | 24 | Ultra Librarian |
| TSSOP (PW) | 24 | Ultra Librarian |
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