SN74AHCT16244

Name: SN74AHCT16244
Brand: TI
SKU: SN74AHCT16244
Price: 0.603 USD

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16-Kanal-Puffer, 4,5 V bis 5,5 V, mit TTL-kompatiblen CMOS-Eingängen und Tri-State-Ausgängen

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Datenblatt

document-pdfAcrobat SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. J) (Englisch) PDF | HTML

SN74AHCT16244

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Datenblatt

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Produktdetails

Technology family

AHCT

Supply voltage (min) (V)

4.5

Supply voltage (max) (V)

5.5

Number of channels

IOL (max) (mA)

Supply current (max) (µA)

IOH (max) (mA)

-8

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 125

Technology family

AHCT

Supply voltage (min) (V)

4.5

Supply voltage (max) (V)

5.5

Number of channels

IOL (max) (mA)

Supply current (max) (µA)

IOH (max) (mA)

-8

Input type

TTL-Compatible CMOS

Output type

3-State

Features

Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 125

SSOP (DL)

164.358 mm² 15.88 x 10.35

TSSOP (DGG)

101.25 mm² 12.5 x 8.1

TVSOP (DGV)

62.08 mm² 9.7 x 6.4

Members of the Texas Instruments Widebus™ Family
EPIC™ (Enhanced-Performance Implanted CMOS)
Process
Inputs are TTL-Voltage Compatible
Distributed V_CC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 250 mA
Per JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
Package Options Include:
- Plastic Shrink Small Outline (DL) Package
- Thin Shrink Small Outline (DGG) Package
- Thin Very Small Outline (DGV) Package
- 380-mil Fine-Pitch Ceramic Flat (WD)
  Package Using 25-mil Center-to-Center
  Spacings

Members of the Texas Instruments Widebus™ Family
EPIC™ (Enhanced-Performance Implanted CMOS)
Process
Inputs are TTL-Voltage Compatible
Distributed V_CC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB Layout
Latch-Up Performance Exceeds 250 mA
Per JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015
Package Options Include:
- Plastic Shrink Small Outline (DL) Package
- Thin Shrink Small Outline (DGG) Package
- Thin Very Small Outline (DGV) Package
- 380-mil Fine-Pitch Ceramic Flat (WD)
  Package Using 25-mil Center-to-Center
  Spacings

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

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Technische Dokumentation

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Alle anzeigen 19

	Typ	Titel		Datum
*	Data sheet	SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. J)	PDF \| HTML	13 Okt 2014
	Application note	Implications of Slow or Floating CMOS Inputs (Rev. E)		26 Jul 2021
	Selection guide	Little Logic Guide 2018 (Rev. G)		06 Jul 2018
	Selection guide	Logic Guide (Rev. AB)		12 Jun 2017
	Application note	How to Select Little Logic (Rev. A)		26 Jul 2016
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		02 Dez 2015
	User guide	LOGIC Pocket Data Book (Rev. B)		16 Jan 2007
	Product overview	Design Summary for WCSP Little Logic (Rev. B)		04 Nov 2004
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		08 Jul 2004
	Application note	Selecting the Right Level Translation Solution (Rev. A)		22 Jun 2004
	Application note	Advanced High-Speed CMOS (AHC) Logic Family (Rev. C)		02 Dez 2002
	Application note	Texas Instruments Little Logic Application Report		01 Nov 2002
	Application note	TI IBIS File Creation, Validation, and Distribution Processes		29 Aug 2002
	Design guide	AHC/AHCT Designer's Guide February 2000 (Rev. D)		24 Feb 2000
	Product overview	Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C)		01 Apr 1998
	Application note	Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices		01 Dez 1997
	Application note	Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)		01 Aug 1997
	Application note	CMOS Power Consumption and CPD Calculation (Rev. B)		01 Jun 1997
	Application note	Live Insertion		01 Okt 1996

Design und Entwicklung

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