SN74CB3T3257

Name: SN74CB3T3257
Brand: TI
SKU: SN74CB3T3257
Price: 0.569 USD

AKTIV

3,3-Kanal-FET-Busschalter mit Pegelumsetzer, 2 V, 1:4 (SPDT)

Jetzt bestellen

Datenblatt

document-pdfAcrobat SN74CB3T3257 datasheet (Englisch)

SN74CB3T3257

AKTIV

Datenblatt

Jetzt bestellen

Produktdetails

Configuration

2:1 SPDT

Number of channels

4

Power supply voltage - single (V)

2.5, 3.3

Protocols

Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART

Ron (typ) (Ω)

5

CON (typ) (pF)

4

ON-state leakage current (max) (µA)

20

Bandwidth (MHz)

100

Operating temperature range (°C)

-40 to 85

Features

Powered-off protection, Signal path translation

Input/output continuous current (max) (mA)

128

Rating

Catalog

Drain supply voltage (max) (V)

3.6

Supply voltage (max) (V)

3.6

Configuration

2:1 SPDT

Number of channels

4

Power supply voltage - single (V)

2.5, 3.3

Protocols

Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART

Ron (typ) (Ω)

5

CON (typ) (pF)

4

ON-state leakage current (max) (µA)

20

Bandwidth (MHz)

100

Operating temperature range (°C)

-40 to 85

Features

Powered-off protection, Signal path translation

Input/output continuous current (max) (mA)

128

Rating

Catalog

Drain supply voltage (max) (V)

3.6

Supply voltage (max) (V)

3.6

TSSOP (PW)

16

32 mm² 5 x 6.4

TVSOP (DGV)

16

23.04 mm² 3.6 x 6.4

Output Voltage Translation Tracks V_CC
Supports Mixed-Mode Signal Operation On All Data I/O Ports
- 5-V Input Down To 3.3-V Output Level Shift With 3.3-V V_CC
- 5-V/3.3-V Input Down To 2.5-V Output Level Shift With 2.5-V V_CC
5-V Tolerant I/Os With Device Powered-Up or Powered-Down
Bidirectional Data Flow, With Near-Zero Propagation Delay
Low ON-State Resistance (r_on) Characteristics (r_on = 5 Typical)
Low Input/Output Capacitance Minimizes Loading (C_io(OFF) = 5 pF Typical)
Data and Control Inputs Provide Undershoot Clamp Diodes
Low Power Consumption (I_CC = 20 µA Max)
V_CC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
Supports Digital Applications: Level Translation, USB Interface, Memory Interleaving, Bus Isolation
Ideal for Low-Power Portable Equipment

Output Voltage Translation Tracks V_CC
Supports Mixed-Mode Signal Operation On All Data I/O Ports
- 5-V Input Down To 3.3-V Output Level Shift With 3.3-V V_CC
- 5-V/3.3-V Input Down To 2.5-V Output Level Shift With 2.5-V V_CC
5-V Tolerant I/Os With Device Powered-Up or Powered-Down
Bidirectional Data Flow, With Near-Zero Propagation Delay
Low ON-State Resistance (r_on) Characteristics (r_on = 5 Typical)
Low Input/Output Capacitance Minimizes Loading (C_io(OFF) = 5 pF Typical)
Data and Control Inputs Provide Undershoot Clamp Diodes
Low Power Consumption (I_CC = 20 µA Max)
V_CC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0 to 5-V Signaling Levels (0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
Supports Digital Applications: Level Translation, USB Interface, Memory Interleaving, Bus Isolation
Ideal for Low-Power Portable Equipment

The SN74CB3T3257 is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (r_on), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks V_CC. The SN74CB3T3257 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).

The SN74CB3T3257 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single output-enable (OE)\ input. The select (S) input controls the data path of the multiplexer/demultiplexer. When OE\ is low, the multiplexer/demultiplexer is enabled, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE\ is high, the multiplexer/demultiplexer is disabled, and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using I_off. The I_off feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CB3T3257 is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (r_on), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks V_CC. The SN74CB3T3257 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1).

The SN74CB3T3257 is a 4-bit 1-of-2 multiplexer/demultiplexer with a single output-enable (OE)\ input. The select (S) input controls the data path of the multiplexer/demultiplexer. When OE\ is low, the multiplexer/demultiplexer is enabled, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE\ is high, the multiplexer/demultiplexer is disabled, and a high-impedance state exists between the A and B ports.

This device is fully specified for partial-power-down applications using I_off. The I_off feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, OE\ should be tied to V_CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

filter

Andere Analogschalter und Multiplexer suchen

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star

=Von TI ausgewählte Top-Empfehlungen für dieses Produkt

Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.

Alle anzeigen 14

	Typ	Titel		Datum
*	Data sheet	SN74CB3T3257 datasheet		15 Okt 2003
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	02 Jun 2022
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	01 Dez 2021
	Application note	CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C)	PDF \| HTML	19 Nov 2021
	Application brief	Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C)	PDF \| HTML	06 Jan 2021
	Selection guide	Logic Guide (Rev. AB)		12 Jun 2017
	Application note	How to Select Little Logic (Rev. A)		26 Jul 2016
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		02 Dez 2015
	User guide	LOGIC Pocket Data Book (Rev. B)		16 Jan 2007
	More literature	Digital Bus Switch Selection Guide (Rev. A)		10 Nov 2004
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		08 Jul 2004
	Application note	Selecting the Right Level Translation Solution (Rev. A)		22 Jun 2004
	User guide	Signal Switch Data Book (Rev. A)		14 Nov 2003
	Application note	Bus FET Switch Solutions for Live Insertion Applications		07 Feb 2003

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

Benutzerhandbuch: PDF