Produktdetails

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 145 ON-state leakage current (max) (µA) 0.06 Supply current (typ) (µA) 35 Bandwidth (MHz) 90 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 370 Rating Catalog Drain supply voltage (max) (V) 36 Supply voltage (max) (V) 36 Negative rail supply voltage (max) (V) -18
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 5, 12, 16, 20, 36 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 145 ON-state leakage current (max) (µA) 0.06 Supply current (typ) (µA) 35 Bandwidth (MHz) 90 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (max) (mA) 370 Rating Catalog Drain supply voltage (max) (V) 36 Supply voltage (max) (V) 36 Negative rail supply voltage (max) (V) -18
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Dual supply range: ±4.5V to ±18V
  • Single supply range: 4.5V to 36V
  • Low on-resistance: 2Ω
  • High current support: 330mA (maximum) (WQFN)
  • High current support: 220mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation
  • Dual supply range: ±4.5V to ±18V
  • Single supply range: 4.5V to 36V
  • Low on-resistance: 2Ω
  • High current support: 330mA (maximum) (WQFN)
  • High current support: 220mA (maximum) (TSSOP)
  • –40°C to +125°C operating temperature
  • 1.8V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation

The TMUX6211, TMUX6212, and TMUX6213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5V to 36V), dual supplies (±4.5V to ±18V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX621x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

The switches of the TMUX621x are controlled with appropriate logic control inputs on the SELx pins. The TMUX621x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

The TMUX6211, TMUX6212, and TMUX6213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, single-throw (SPST) switch channels. The devices work with a single supply (4.5V to 36V), dual supplies (±4.5V to ±18V), or asymmetric supplies (such as VDD = 12V, VSS = –5V). The TMUX621x supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD.

The switches of the TMUX621x are controlled with appropriate logic control inputs on the SELx pins. The TMUX621x are part of the precision switches and multiplexers family of devices and have very low on and off leakage currents allowing them to be used in high precision measurement applications.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet TMUX621x 36V , Low-RON, 1:1 (SPST), 4-Channel Precision Switches with 1.8V Logic datasheet (Rev. D) PDF | HTML 11 Jul 2024
Application brief Dynamically Controlling Signal in a CWD Receive Path for Ultrasound PDF | HTML 18 Jan 2021

Design und Entwicklung

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Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Simulationsmodell

TMUX6211 IBIS Model

SCDM252.ZIP (351 KB) - IBIS Model
Simulationsmodell

TMUX6211 Pspice Model

SCDM288.ZIP (208 KB) - PSpice Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

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