Produktdetails

Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 125 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 150 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
Protocols Analog Audio Configuration 2:1 SPDT Number of channels 2 Bandwidth (MHz) 18.3 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 520 Input/output voltage (min) (V) -3.2 Input/output voltage (max) (V) 5.5 Supply current (typ) (µA) 1 ESD HBM (typ) (kV) 1.5 Operating temperature range (°C) -40 to 125 Crosstalk (dB) -78 ESD CDM (kV) 1.5 Input/output continuous current (max) (mA) 150 CON (typ) (pF) 370 Off isolation (typ) (dB) -70 Ron (max) (mΩ) 1300 Ron channel match (max) (Ω) 0.3 RON flatness (typ) (Ω) 0.076 Turnoff time (disable) (max) (ns) 70 Turnon time (enable) (max) (ns) 120 VIH (min) (V) 1.4 VIL (max) (V) 0.8
VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • Qualified for automotive applications
  • Specified Break-Before-Make (BBM) switching
  • Negative signal swing capability: Maximum swing
    From –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal shunt switch prevents audible click-and-
    pop when switching between two sources
  • Low On-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent channel to channel On-state resistance
    matching
  • 2.3-V to 5.5-V power supply (VCC)
  • Latch-up performance meets 100 mA per AEC
    Q100-004
  • ESD performance
    • 2500-V Human-Body Model tested per AEC
      Q100-002
    • 1500-V Charged-Device Model tested per AEC
      Q100-011
  • Qualified for automotive applications
  • Specified Break-Before-Make (BBM) switching
  • Negative signal swing capability: Maximum swing
    From –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal shunt switch prevents audible click-and-
    pop when switching between two sources
  • Low On-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent channel to channel On-state resistance
    matching
  • 2.3-V to 5.5-V power supply (VCC)
  • Latch-up performance meets 100 mA per AEC
    Q100-004
  • ESD performance
    • 2500-V Human-Body Model tested per AEC
      Q100-002
    • 1500-V Charged-Device Model tested per AEC
      Q100-011

The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V supply. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transfer of a signal from one path to another. Low On-state resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.

The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V supply. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transfer of a signal from one path to another. Low On-state resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 6
Typ Titel Datum
* Data sheet TS5A22364-Q1 0.65-Ω Dual SPDT Analog Switch with Negative Signaling Capability datasheet (Rev. A) PDF | HTML 24 Jun 2016
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dez 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Schnittstellenadapter

LEADED-ADAPTER1 — Oberflächenmontierbarer DIP-Header-Adapter zur schnellen Prüfung der 5-, 8-, 10-, 16- und 24-poligen

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Benutzerhandbuch: PDF
Simulationsmodell

TS5A22364 HSpice Model

SCDM123.ZIP (105 KB) - HSpice Model
Simulationsmodell

TS5A22364 IBIS Model

SCDM122.ZIP (67 KB) - IBIS Model
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VSSOP (DGS) 10 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos