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Microcontroladores (MCU) y procesadores
Procesadores basados en Arm

OMAP-L137

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DSP de punto flotante de baja potencia C674x + procesador Arm9 - hasta 456 MHz

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OMAP-L137

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Detalles del producto

Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 125
Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating Catalog Power supply solution TPS65910 Operating temperature range (°C) -40 to 125
PBGA (ZKB) 256 289 mm² 17 x 17
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • Dual Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • Embedded ICE-RT™ for Real-Time Debug
  • ARM9™ Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2736 MFLOPS C674x
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Fixed- and Floating-Point VLIW DSP Core
    • Load-Store Architecture with Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop
      Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • 128KB of RAM Shared Memory
  • 3.3-V LVCMOS I/Os (Except for USB Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM with 128-MB Address Space
    • EMIFB
      • 32-Bit or 16-Bit SDRAM with 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • UART0 with Modem Control Signals
    • Autoflow Control Signals (CTS, RTS) on UART0 Only
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
  • Two Master and Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load and Store RISC Architecture
      • 4KB of Instruction RAM per Core
      • 512 Bytes of Data RAM per Core
      • PRUSS can be Disabled via Software to Save Power
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) with Integrated PHY (USB1)
  • USB 2.0 OTG Port with Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
  • Three Multichannel Audio Serial Ports (McASPs):
    • Six Clock Zones and 28 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable (McASP2)
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • RMII Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Three Enhanced Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Time-Stamps
  • Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
  • Commercial, Industrial, Extended, or Automotive Temperature
  • Software Support
    • TI DSP/BIOS
    • Chip Support Library and DSP Library
  • Dual Core SoC
    • 375- and 456-MHz ARM926EJ-S RISC MPU
    • 375- and 456-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • Embedded ICE-RT™ for Real-Time Debug
  • ARM9™ Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 3648 MIPS and 2736 MFLOPS C674x
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 256KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Fixed- and Floating-Point VLIW DSP Core
    • Load-Store Architecture with Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop
      Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • 128KB of RAM Shared Memory
  • 3.3-V LVCMOS I/Os (Except for USB Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM with 128-MB Address Space
    • EMIFB
      • 32-Bit or 16-Bit SDRAM with 256-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • UART0 with Modem Control Signals
    • Autoflow Control Signals (CTS, RTS) on UART0 Only
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPIs) Each with One Chip Select
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO)
  • Two Master and Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) with 16-Bit-Wide Muxed Address/Data Bus for High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load and Store RISC Architecture
      • 4KB of Instruction RAM per Core
      • 512 Bytes of Data RAM per Core
      • PRUSS can be Disabled via Software to Save Power
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • USB 1.1 OHCI (Host) with Integrated PHY (USB1)
  • USB 2.0 OTG Port with Integrated PHY (USB0)
    • USB 2.0 High- and Full-Speed Client
    • USB 2.0 High-, Full-, and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) RX and TX
  • Three Multichannel Audio Serial Ports (McASPs):
    • Six Clock Zones and 28 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable (McASP2)
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • RMII Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • Real-Time Clock with 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Three Enhanced Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter with Period and Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric, or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Time-Stamps
  • Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • 256-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZKB Suffix], 1.0-mm Ball Pitch
  • Commercial, Industrial, Extended, or Automotive Temperature

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program Memory Management Units (MMUs) with table look-aside buffers. The ARM core has separate 16-KB instruction and 16KB of data caches. Both memory blocks are four-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The OMAP-L137 DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32-KB direct mapped cache and the Level 1 data cache (L1D) is a 32-KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB of RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; 3 multichannel audio serial ports (McASPs) with 16/12/4 serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host-port interface (HPI); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 3 UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the OMAP-L137 device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The HPI, I2C, SPI, USB1.1, and USB2.0 ports allow the OMAP-L137 device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The OMAP-L137 device has a complete set of development tools for both the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for visibility into source code execution.
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Documentación técnica

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Tipo Título Fecha
* Data sheet OMAP-L137 Low-Power Applications Processor datasheet (Rev. G) PDF | HTML 17 jun 2014
* Errata OMAP-L137 C6000 DSP+ARM Processor Errata (Silicon Revs 3.0, 2.1, 2.0, 1.1 & 1.0) (Rev. I) 17 jun 2014
* User guide OMAP-L137 C6000 DSP+ARM Processor Technical Reference Manual (Rev. D) 21 sep 2016
User guide ARM Assembly Language Tools v20.2.0.LTS User's Guide (Rev. Z) PDF | HTML 30 mar 2023
User guide ARM Optimizing C/C++ Compiler v20.2.0.LTS User's Guide (Rev. W) PDF | HTML 30 mar 2023
Application note High-Speed Interface Layout Guidelines (Rev. J) PDF | HTML 24 feb 2023
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 01 jun 2020
User guide ARM Assembly Language Tools v19.6.0.STS User's Guide (Rev. X) 03 jun 2019
User guide ARM Optimizing C/C++ Compiler v19.6.0.STS User's Guide (Rev. U) 03 jun 2019
Application note General Hardware Design/BGA PCB Design/BGA 22 feb 2019
Application note OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 14 feb 2019
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 10 ene 2019
User guide ARM Assembly Language Tools v18.12.0.LTS User's Guide (Rev. W) 19 nov 2018
User guide ARM Optimizing C/C++ Compiler v18.12.0.LTS User's Guide (Rev. T) 19 nov 2018
White paper Designing professional audio mixers for every scenario 28 jun 2018
User guide ARM Assembly Language Tools v18.1.0.LTS User's Guide (Rev. U) 16 ene 2018
User guide ARM Optimizing C/C++ Compiler v18.1.0.LTS User's Guide (Rev. R) 16 ene 2018
User guide ARM Assembly Language Tools v17.9.0.STS User's Guide (Rev. T) 30 sep 2017
User guide ARM Optimizing C/C++ Compiler v17.9.0.STS User's Guide (Rev. Q) 30 sep 2017
User guide ARM Assembly Language Tools v17.6.0.STS User's Guide (Rev. S) 21 jun 2017
User guide ARM Optimizing C/C++ Compiler v17.6.0.STS User's Guide (Rev. P) 21 jun 2017
User guide ARM Assembly Language Tools v16.9.0.LTS User's Guide (Rev. P) 30 abr 2016
User guide ARM Optimizing C/C++ Compiler v16.9.0.LTS User's Guide (Rev. M) 30 abr 2016
User guide ARM Assembly Language Tools v5.2 User's Guide (Rev. M) 05 nov 2014
User guide ARM Optimizing C/C++ Compiler v5.2 User's Guide (Rev. J) 05 nov 2014
User guide TMS320C6000 Assembly Language Tools v 7.4 User's Guide (Rev. W) 21 ago 2012
User guide TMS320C6000 Optimizing Compiler v 7.4 User's Guide (Rev. U) 21 ago 2012
Application note Using the OMAP-L1x7 Bootloader (Rev. G) 01 jun 2012
Application note Powering the OMAP-L132/OMAP-L137/OMAP-L138 Processor with the TPS650061 13 abr 2012
White paper MityDSP®-L138F Software Defined Radio Using uPP Data Transfer (Rev. A) 02 feb 2012
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
User guide TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 14 sep 2011
White paper OpenCV on TI’s DSP+ARM® 27 jul 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011
Application note Power Solution Using Discrete DC/DC Converters and LDOs (Rev. B) 26 ago 2010
User guide TMS320C674x DSP Megamodule Reference Guide (Rev. A) 03 ago 2010
User guide TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 30 jul 2010
Application note OMAP-L137 Power Consumption Summary 30 jun 2010
Application note Power Solution using LDO's (Rev. A) 25 mar 2010
Application note Power Solution using a Dual DCDC Converter and a LDO (Rev. A) 25 mar 2010
User guide TMS320C6000 Assembly Language Tools v 7.0 User's Guide (Rev. S) 18 mar 2010
User guide TMS320C6000 Optimizing Compiler v 7.0 User's Guide (Rev. Q) 18 mar 2010
More literature OMAP-L1x Software Solutions Diagram (Rev. B) 07 dic 2009
Application note Canny Edge Detection Implementation on TMS320C64x/64x+ Using VLIB 25 nov 2009
Application note OMAP-L137 TMS320C6747/6745/6743 Pin Multiplexing Utility (Rev. A) 26 sep 2009
Application note OMAP-L137 Complementary Products 23 sep 2009
White paper Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 24 jun 2009
Application note TMS320C6747/45/43 & OMAP-L1x7 USB Downstream Host Compliance Testing 12 mar 2009
Application note TMS320C6747/45/43 & OMAP-L1x7 USB Upstream Device Compliance Testing 12 mar 2009
Application note TMS320C674x/OMAP-L1x USB Compliance Checklist 12 mar 2009
Application note OMAP-L137 Technical Brief (Rev. B) 18 feb 2009
User guide TMS320C674x DSP Cache User's Guide (Rev. A) 11 feb 2009
User guide TMS320C6000 Assembly Language Tools v 6.1 User's Guide (Rev. Q) 15 may 2008
User guide TMS320C6000 Optimizing Compiler v 6.1 User's Guide (Rev. O) 15 may 2008
User guide TMS320C6000 Assembly Language Tools v 6.0 Beta User's Guide (Rev. P) 31 oct 2006
User guide TMS320C6000 Optimizing Compiler v 6.0 Beta User's Guide (Rev. N) 29 jul 2005

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TMDSOSKL137 — Kit básico de punto flotante OMAP-L137/TMS320C6747

The OMAP-L137/TMS320C6747 Floating-Point Starter Kit, developed jointly with Spectrum Digital Inc., is a low-cost development platform designed to speed the development of high-precision applications based on TI's OMAP-L13x applications processors and TMS320C674x fixed-/floating-point DSPs (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. El XDS200 presenta un equilibrio de bajo costo con buen rendimiento en comparación con el XDS110 de bajo costo y el XDS560v2 de alto rendimiento. Es compatible con una amplia (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-OMAPL137 — TI-RTOS Processor SDK for OMAP-L137 and C6747, C6745, C6743 (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

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Productos
Procesadores basados en Arm
OMAP-L137 — DSP de punto flotante de baja potencia C674x + procesador Arm9 - hasta 456 MHz
Desarrollo de hardware
Placa de evaluación
TMDSOSKL137 — Kit básico de punto flotante OMAP-L137/TMS320C6747
Opciones de descarga
Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
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Controlador o biblioteca

SPRC121 — TMS320C67x Biblioteca DSP

The TI C67x DSPLIB is an optimized floating-point DSP Function Library for C programmers using TMS320C67x devices. It includes C-callable, assembly-optimized general-purpose signal-processing routines. These routines are typically used in computationally intensive real-time applications where (...)
Guía del usuario: PDF
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Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
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Controlador o biblioteca

SPRC265 — TMS320C6000 Biblioteca DSP (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
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Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
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Controlador o biblioteca

WIND-3P-VXWORKS-LINUX-OS — Procesadores Wind River VxWorks y sistemas operativos de Linux

Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
Desde: Wind River Systems
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
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Sistema operativo (SO)

MG-3P-NUCLEUS-RTOS — Mentor Graphics Nucleus RTOS

Software driven power management is crucial for battery operated or low power budget embedded systems. Embedded developers can now take advantage of the latest power saving features in popular TI devices with the built-in Power Management Framework in the Nucleus RTOS. Developers specify (...)
Desde: Mentor Graphics Corporation
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Códec de software

ADT-3P-DSPVOIPCODECS — Tecnologías digitales adaptables DSP VOIP, códecs de voz y audio

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
Desde: Adaptive Digital Technologies, Inc.
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Códec de software

AURO-3P-3DENGINE — Auro Technologies Auro-CODEC y software Auro-Matic

Auro Technologies’ Auro-Engine includes their Auro-Codec and Auro-Matic elements for real time audio stream encoding and up mixing affording 3D audio user experiences. The Auro-Codec and Auro-Matic algorithms have been ported to select TI C6x DSPs.
Desde: Auro Technologies N.V.
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Códec de software

VOCAL-3P-DSPVOIPCODECS — Códecs de tecnologías vocales DSP VoIP

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
Desde: VOCAL Technologies, Ltd.
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Modelo de simulación

OMAP-L137 ZKB BSDL Model (Rev. B)

SPRM328B.ZIP (19 KB) - BSDL Model
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Modelo de simulación

OMAP-L137 ZKB IBIS Model (Rev. A)

SPRM333A.ZIP (176 KB) - IBIS Model
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Diseños de referencia

PR2084 — Alimentación de OMAP-L132/OMAP-L137/OMAP-L138 con TPS650061

This reference design presents a complete power solution and low-cost, discrete sequencing circuit for the OMAP-L132, OMAP-L137, and OMAP-L138 processors.
Test report: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
PBGA (ZKB) 256 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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Soporte y capacitación

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