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Circuitos integrados HDMI, DisplayPort y MIPI

SN65DSI85-Q1

ACTIVO

MIPI DSI de doble canal a puente LVDS Flatlink™ de doble enlace de calidad automotriz

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SN65DSI85-Q1

ACTIVO
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Detalles del producto

Type Bridge Protocols LVDS, MIPI DSI Rating Automotive Speed (max) (Gbpp) 8 Supply voltage (V) 1.8 Operating temperature range (°C) -40 to 105
Type Bridge Protocols LVDS, MIPI DSI Rating Automotive Speed (max) (Gbpp) 8 Supply voltage (V) 1.8 Operating temperature range (°C) -40 to 105
HTQFP (PAP) 64 144 mm² 12 x 12
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
  • Dual-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
  • Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
  • Suitable for 60-fps WQXGA 2560 × 1600 Resolution at 18-bpp and 24-bpp Color, and 60 fps (120 fps Equivalent) WUXGA 1920 × 1200 Resolution With 3D Graphics at 24-bpp Color
  • MIPI Front-End Configurable for Single-Channel or Dual-Channel DSI Configurations
  • Output Configurable for Single-Link or Dual-Link LVDS
  • Supports Dual-Channel DSI ODD or EVEN and LEFT or RIGHT Operating Modes
  • Supports Two Single-Channel DSI to Two Single-Link LVDS Operating Mode
  • LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
  • LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
  • 1.8-V Main VCC Power Supply
  • Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
  • LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
  • Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature
    • Device HBM ESD Classification Level 3A
    • Device CDM ESD Classification Level C6
  • Implements MIPI D-PHY Version 1.00.00 Physical Layer Front-End and Display Serial Interface (DSI) Version 1.02.00
  • Dual-Channel DSI Receiver Configurable for One, Two, Three, or Four D-PHY Data Lanes Per Channel Operating up to 1 Gbps Per Lane
  • Supports 18-bpp and 24-bpp DSI Video Packets with RGB666 and RGB888 Formats
  • Suitable for 60-fps WQXGA 2560 × 1600 Resolution at 18-bpp and 24-bpp Color, and 60 fps (120 fps Equivalent) WUXGA 1920 × 1200 Resolution With 3D Graphics at 24-bpp Color
  • MIPI Front-End Configurable for Single-Channel or Dual-Channel DSI Configurations
  • Output Configurable for Single-Link or Dual-Link LVDS
  • Supports Dual-Channel DSI ODD or EVEN and LEFT or RIGHT Operating Modes
  • Supports Two Single-Channel DSI to Two Single-Link LVDS Operating Mode
  • LVDS Output-Clock Range of 25 MHz to 154 MHz in Dual-Link or Single-Link Mode
  • LVDS Pixel Clock May be Sourced from Free-Running Continuous D-PHY Clock or External Reference Clock (REFCLK)
  • 1.8-V Main VCC Power Supply
  • Low Power Features Include SHUTDOWN Mode, Reduced LVDS Output Voltage Swing, Common Mode, and MIPI Ultra-Low Power State (ULPS) Support
  • LVDS Channel SWAP, LVDS PIN Order Reverse Feature for Ease of PCB Routing
  • Packaged in 64-pin 10 mm × 10 mm HTQFP (PAP) PowerPAD™ IC Package

The SN65DSI85-Q1 DSI-to-LVDS bridge features a dual-channel MIPI D-PHY receiver front-end
configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 8 Gbps. The bridge decodes MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS, single-link LVDS, or two Single-Link LVDS interfaces with four data lanes per link.

The SN65DSI85-Q1 device is well suited for WQXGA (2560 × 1600) at 60 frames per second (fps), as well as 3D Graphics at WUXGA and True HD (1920 × 1080) resolutions at an equivalent 120 fps with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.

The SN65DSI85-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.

The SN65DSI85-Q1 DSI-to-LVDS bridge features a dual-channel MIPI D-PHY receiver front-end
configuration with four lanes per channel operating at 1 Gbps per lane and a maximum input bandwidth of 8 Gbps. The bridge decodes MIPI DSI 18-bpp RGB666 and 24-bpp RGB888 packets and converts the formatted video data-stream to an LVDS output operating at pixel clocks operating from 25 MHz to 154 MHz, offering a dual-link LVDS, single-link LVDS, or two Single-Link LVDS interfaces with four data lanes per link.

The SN65DSI85-Q1 device is well suited for WQXGA (2560 × 1600) at 60 frames per second (fps), as well as 3D Graphics at WUXGA and True HD (1920 × 1080) resolutions at an equivalent 120 fps with up to 24 bits-per-pixel (bpp). Partial line buffering is implemented to accommodate the data stream mismatch between the DSI and LVDS interfaces.

The SN65DSI85-Q1 device is implemented in a small outline 10 mm × 10 mm HTQFP package with a
0.5-mm pitch, and operates across a temperature range from –40°C to 105°C.

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SN65DSI84-Q1 ACTIVO Puente MIPI® DSI de canal único a LVDS de enlace doble de calidad automotriz Supports 8 Gbps rather than 12 Gbps

Documentación técnica

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* Data sheet SN65DSI85-Q1 Automotive Dual-Channel MIPI DSI to Dual-Link LVDS Bridge datasheet (Rev. B) PDF | HTML 28 jun 2018
Application note Troubleshooting SN65DSI8x - Tips and Tricks 27 ago 2018
EVM User's guide SN65DSI83, SN65DSI84, and SN65DSI85 EVM User’s Manual and Implementation Guide 17 nov 2015

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

SN65DSI85Q1-EVM — Módulo de evaluación de MIPI® DSI de doble canal a puente LVDS FlatLink™ de doble enlace

The SN65DSI85Q1EVM is a PCB created to help customers implementing SN65DSI85Q1 in system hardware.  This EVM includes on-board connectors for DSI input and LVDS output signals.  These connectors are for connecting MIPI DPHY compliant DSI source and LVDS panels to the EVM.
Guía del usuario: PDF
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Herramienta de simulación

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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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TINA-TI — Programa de simulación analógica basado en SPICE

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Guía del usuario: PDF
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Diseños de referencia

TIDA-01453 — Diseño de referencia del puente MIPI® DSI a OLDI/LVDS para la unidad principal de información y entr

This reference design offers two display interface options: an Automotive processor with MIPI® DSI output and an Automotive infotainment video display panel with OpenLDI (OLDI) / LVDS input The reference design provides two variations. Setup one converts the system on chip (SoC) DSI video (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
HTQFP (PAP) 64 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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