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Convertidores digital-analógicos (DAC)
DAC de precisión (≤ 10 MSPS)

TLV5619-EP

ACTIVO

DAC monocanal de 12 bits, paralelo, salida de tensión, baja potencia, producto mejorado

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DAC60501 ACTIVO DAC de salida de tensión, 12 bits reales, de un canal, SPI/I2C en encapsulado WSON con referencia in Smaller 2.5mm × 2.5mm package with integrated reference

TLV5619-EP

ACTIVO
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Detalles del producto

Resolution (bps) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating HiRel Enhanced Product Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 125 Product type General-purpose DAC
Resolution (bps) 12 Number of DAC channels 1 Interface type Parallel Output type Buffered Voltage Output voltage range (V) 0 to 5.5 INL (max) (±LSB) 4 Settling time (µs) 1 Reference type Ext Architecture String Rating HiRel Enhanced Product Sample/update rate (Msps) 1 Power consumption (typ) (mW) 4.3 Operating temperature range (°C) -40 to 125 Product type General-purpose DAC
SOIC (DW) 20 131.84 mm² 12.8 x 10.3
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL), ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • applications
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product Change Notification
  • Qualification Pedigree
  • Single Supply 2.7-V to 5.5-V Operation
  • ±0.4 LSB Differential Nonlinearity (DNL), ±1.5 LSB Integral Nonlinearity (INL)
  • 12-Bit Parallel Interface
  • Compatible With TMS320 DSP
  • Internal Power On Reset
  • Settling Time 1 µs Typ
  • Low Power Consumption:
    • 8 mW for 5-V Supply
    • 4.3 mW for 3-V Supply
  • Reference Input Buffers
  • Voltage Output
  • Monotonic Over Temperature
  • Asynchronous Update
  • applications
    • Battery Powered Test Instruments
    • Digital Offset and Gain Adjustment
    • Battery Operated/Remote Industrial Controls
    • Machine and Motion Control Devices
    • Cordless and Wireless Telephones
    • Speech Synthesis
    • Communication Modulators
    • Arbitrary Waveform Generation

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.

The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface. The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC\ pin. During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power consumption can be lowered to 50 nW by setting the DAC to power-down mode.

The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve stability and reduce settling time.
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Documentación técnica

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Tipo Título Fecha
* Data sheet 2.7 V to 5.5 V 12-Bit Parallel Digital-to-Analog Converter with Power Down datasheet (Rev. A) 05 dic 2003
* VID TLV5619-EP VID V6203615 21 jun 2016

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

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PSPICE-FOR-TI — PSpice® para herramienta de diseño y simulación de TI

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Encapsulado Pines Símbolos CAD, huellas y modelos 3D
SOIC (DW) 20 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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