Inicio Microcontroladores (MCU) y procesadores Procesadores digitales de señales (DSP)
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Microcontroladores (MCU) y procesadores
Procesadores digitales de señales (DSP)

TMS320C6742

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DSP de punto flotante C674x de 200 MHz y baja potencia

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TMS320C6742

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Detalles del producto

DSP type 1 C674x DSP (max) (MHz) 200 CPU 32-/64-bit Operating system SYS/BIOS Security Basic Secure Boot Ethernet MAC 10/100 Rating Catalog Operating temperature range (°C) -40 to 105
DSP type 1 C674x DSP (max) (MHz) 200 CPU 32-/64-bit Operating system SYS/BIOS Security Basic Secure Boot Ethernet MAC 10/100 Rating Catalog Operating temperature range (°C) -40 to 105
NFBGA (ZWT) 361 256 mm² 16 x 16
  • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 64KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • One Configurable 16550-Type UART Module:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • One Serial Peripheral Interface (SPI) With Multiple Chip Selects
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address and Data Bus For High Bandwidth
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • One Multichannel Buffered Serial Port (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZCE Suffix], 0.65-mm Ball Pitch
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

  • 200-MHz C674x Fixed- and Floating-Point VLIW DSP
  • C674x Instruction Set Features
    • Superset of the C67x+ and C64x+ ISAs
    • Up to 1600 MIPS and 1200 MFLOPS
    • Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two-Level Cache Memory Architecture
    • 32KB of L1P Program RAM/Cache
    • 32KB of L1D Data RAM/Cache
    • 64KB of L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Nonaligned Support
    • 64 General-Purpose Registers (32-Bit)
    • Six ALU (32- and 40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
      • Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units:
      • Mixed-Precision IEEE Floating-Point Multiply Supported up to:
        • 2 SP × SP → SP Per Clock
        • 2 SP × SP → DP Every Two Clocks
        • 2 SP × DP → DP Every Three Clocks
        • 2 DP × DP → DP Every Four Clocks
      • Fixed-Point Multiply Supports Two 32 × 32-Bit Multiplies, Four 16 × 16-Bit Multiplies, or Eight 8 × 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSPBIOS
    • Chip Support Library and DSP Library
  • 1.8-V or 3.3-V LVCMOS I/Os (Except for DDR2 Interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8- or 16-Bit-Wide Data)
      • NAND (8- or 16-Bit-Wide Data)
      • 16-Bit SDRAM With 128-MB Address Space
    • DDR2/Mobile DDR Memory Controller With one of the Following:
      • 16-Bit DDR2 SDRAM With 256-MB Address Space
      • 16-Bit mDDR SDRAM With 256-MB Address Space
  • One Configurable 16550-Type UART Module:
    • With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
  • One Serial Peripheral Interface (SPI) With Multiple Chip Selects
  • Two Master and Slave Inter-Integrated Circuits
    (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address and Data Bus For High Bandwidth
  • One Multichannel Audio Serial Port (McASP):
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO Buffers for Transmit and Receive
  • One Multichannel Buffered Serial Port (McBSPs):
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-Channel TDM
    • FIFO Buffers for Transmit and Receive
  • Real-Time Clock (RTC) With 32-kHz Oscillator and Separate Power Rail
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose or Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Two Enhanced High-Resolution Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge Outputs, 6 Dual-Edge Symmetric Outputs, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Packages:
    • 361-Ball Pb-Free Plastic Ball Grid Array (PBGA) [ZCE Suffix], 0.65-mm Ball Pitch
    • 361-Ball Pb-Free PBGA [ZWT Suffix],
      0.80-mm Ball Pitch
  • Commercial or Extended Temperature

All trademarks are the property of their respective owners.

The TMS320C6742 fixed- and floating-point DSP is a low-power applications processor based on a C674x DSP core. This DSP provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 64-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: one I2C Bus interface; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; one multichannel buffered serial port (McBSP) with FIFO buffers; one serial peripheral interface (SPI) with multiple chip selects; two 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; one UART interface (with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

The TMS320C6742 fixed- and floating-point DSP is a low-power applications processor based on a C674x DSP core. This DSP provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The device DSP core uses a 2-level cache-based architecture. The level 1 program cache (L1P) is a
32-KB direct mapped cache, and the level 1 data cache (L1D) is a 32-KB 2-way, set-associative cache. The level 2 program cache (L2P) consists of a 64-KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: one I2C Bus interface; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; one multichannel buffered serial port (McBSP) with FIFO buffers; one serial peripheral interface (SPI) with multiple chip selects; two 64-bit general-purpose timers each configurable (one configurable as a watchdog); a configurable 16-bit host-port interface (HPI); up to 9 banks of general-purpose input/output (GPIO) pins, with each bank containing 16 pins with programmable interrupt and event generation modes, multiplexed with other peripherals; one UART interface (with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 APWM outputs; two external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals; and a higher speed DDR2/Mobile DDR controller.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the DSP. These tools include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.
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Documentación técnica

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* Data sheet TMS320C6742 Fixed- and Floating-Point DSP datasheet (Rev. F) PDF | HTML 31 ene 2017
* Errata TMS320C6742 Fixed- and Floating-Point DSP (Revs 2.3, 2.1, 2.0, 1.1 & 1.0) (Rev. H) 21 mar 2014
* User guide TMS320C6742 DSP Technical Reference Manual (Rev. C) 12 sep 2016
Application note How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A) PDF | HTML 19 may 2021
Application note OMAPL138/C6748 ROM Bootloader Resources and FAQ (Rev. A) PDF | HTML 21 ene 2021
User guide SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V) 01 jun 2020
Application note Programming mDDR/DDR2 EMIF on OMAP-L1x/C674x 20 dic 2019
User guide L138/C6748 development kit (LCDK) (Rev. A) PDF | HTML 18 sep 2019
Application note Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 11 jun 2019
Application note Programming PLL Controllers on OMAP-L1x8/C674x/AM18xx 25 abr 2019
Application note TMS320C6748/46/42 power consumption summary 26 mar 2019
Application note General Hardware Design/BGA PCB Design/BGA 22 feb 2019
Application note OMAP-L13x / C674x / AM1x schematic review guidelines PDF | HTML 14 feb 2019
Application note McASP Design Guide - Tips, Tricks, and Practical Examples 10 ene 2019
Application note Processor SDK RTOS Audio Benchmark Starter Kit 12 abr 2017
Application note TI DSP Benchmarking 13 ene 2016
Application note Using the TMS320C6748/C6746/C6742 Bootloader (Rev. F) 23 ene 2014
User guide System Analyzer User's Guide (Rev. F) 18 nov 2013
Application note OMAP-L132/L138, TMS320C6742/6/8 Pin Multiplexing Utility (Rev. B) 27 sep 2013
Application note Powering the TMS320C6742, TMS320C6746, and TMS320C6748 With the TPS650061 19 dic 2011
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
User guide TMS320C674x/OMAP-L1x Processor Peripherals Overview Reference Guide (Rev. F) 14 sep 2011
Application note High-Vin, High-Efficiency Power Solution Using DC/DC Converter With DVFS (Rev. C) 29 ago 2011
Application note Medium Integrated Power Solution Using a Dual DC/DC Converter and an LDO (Rev. B) 29 ago 2011
Application note Simple Power Solution Using LDOs (Rev. B) 29 ago 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011
User guide TMS320C674x DSP Megamodule Reference Guide (Rev. A) 03 ago 2010
User guide TMS320C674x DSP CPU and Instruction Set User's Guide (Rev. B) 30 jul 2010
Application note High-Efficiency Power Solution Using DC/DC Converters With DVFS (Rev. A) 05 may 2010
Application note High-Integration, High-Efficiency Power Solution Using DC/DC Converters w/DVFS (Rev. A) 05 may 2010
Application note TMS320C6748/46/42 & OMAP-L132/L138 USB Downstream Host Compliance Testing 17 ago 2009
Application note TMS320C6748/46/42 & OMAP-L1x8 USB Upstream Device Compliance Testing 17 ago 2009
Application note TMS320C6748/46/42 Complementary Products 20 jul 2009
White paper Efficient Fixed- and Floating-Point Code Execution on the TMS320C674x Core 24 jun 2009
Application note TMS320C674x/OMAP-L1x USB Compliance Checklist 12 mar 2009
User guide TMS320C674x DSP Cache User's Guide (Rev. A) 11 feb 2009

Diseño y desarrollo

Soluciones de alimentación

Busque las soluciones de alimentación disponibles para el TMS320C6742. TI ofrece soluciones de alimentación para sistemas en chip (SoC), procesadores, microcontroladores, sensores y matrices de compuertas programables de campo (FPGA), sean o no de TI.

Ver soluciones
Sonda de depuración

TMDSEMU200-U — Sonda de depuración XDS200 USB

El XDS200 es una sonda de depuración (emulador) que se utiliza para depurar dispositivos integrados de TI. El XDS200 presenta un equilibrio de bajo costo con buen rendimiento en comparación con el XDS110 de bajo costo y el XDS560v2 de alto rendimiento. Es compatible con una amplia (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-U — Sonda de depuración USB de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Sonda de depuración

TMDSEMU560V2STM-UE — Sonda de depuración USB y ethernet de seguimiento del sistema XDS560v2

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

No disponible en TI.com
Kit de desarrollo

TMDSLCDK138 — Kit de desarrollo (LCDK) OMAP-L138

The OMAP-L138 DSP+Arm9™ development kit will enable fast and easy Linux software and hardware development. This scalable platform will ease and accelerate software and hardware development of everyday applications that require real-time signal processing and control functional, including (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Kit de desarrollo

TMDSLCDK6748 — Kit de desarrollo (LCDK) TMS320C6748 DSP

The TMS320C6748 DSP development kit (LCDK) is a scalable platform that breaks down development barriers for applications that require embedded analytics and real-time signal processing, including biometric analytics, communications and audio. The low-cost LCDK will also speed and ease your hardware (...)

Guía del usuario: PDF | HTML
No disponible en TI.com
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-C6748 — SDK de procesador para procesadores C6748: Compatibilidad con TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)
View Options
Kit de desarrollo de software (SDK)

PROCESSOR-SDK-RTOS-OMAPL138 — TI-RTOS Processor SDK for OMAP-L138, OMAP-L132 and C6748, C6746, C6742 (No design support from TI available. Refer to Overview- RTOS Highlights for details.)

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Procesadores basados en Arm
OMAP-L138 — DSP de punto flotante de baja potencia C674x + procesador Arm9 - hasta 456MHz
Procesadores digitales de señales (DSP)
TMS320C6742 — DSP de punto flotante C674x de 200 MHz y baja potencia TMS320C6746 — DSP de punto flotante C674x de 456 MHz y baja potencia TMS320C6748 — DSP de punto flotante C674x de 456 MHz y baja potencia, con SATA
Desarrollo de hardware
Kit de desarrollo
TMDSLCDK138 — Kit de desarrollo (LCDK) OMAP-L138 TMDSLCDK6748 — Kit de desarrollo (LCDK) TMS320C6748 DSP
Opciones de descarga
Controlador o biblioteca

MATHLIB — Biblioteca matemática DSP para dispositivos de punto flotante

The Texas Instruments math library is an optimized floating-point math function library for C programmers using TI floating point devices. These routines are typically used in computationally intensive real-time applications where optimal execution speed is critical. By using these routines instead (...)
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Controlador o biblioteca

SPRC264 — TMS320C5000/6000 Biblioteca de imágenes (IMGLIB)

C5000/6000 Image Processing Library (IMGLIB) is an optimized image/video processing function library for C programmers. It includes C-callable general-purpose image/video processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
View Options
Controlador o biblioteca

SPRC265 — TMS320C6000 Biblioteca DSP (DSPLIB)

TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Guía del usuario: PDF
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Controlador o biblioteca

TELECOMLIB — Bibliotecas de telecomunicaciones y medios: FAXLIB, VoLIB y AEC/AER para procesadores TMS320C64x+ y

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
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IDE, configuración, compilador o depurador

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® desktops. It can also (...)

Productos y hardware compatibles

Productos y hardware compatibles

Este recurso de diseño es compatible con la mayoría de los productos de estas categorías.

Revise la página de detalles del producto para verificar la compatibilidad.
Iniciar Opciones de descarga
Códec de software

ADT-3P-DSPVOIPCODECS — Tecnologías digitales adaptables DSP VOIP, códecs de voz y audio

Adaptive Digital is a developer of voice quality enhancement algorithms, and best-in-class acoustic echo cancellation software that work with TI DSPs. Adaptive Digital has extensive experience in the algorithm development, implementation, optimization and configuration tuning. They provide (...)
Desde: Adaptive Digital Technologies, Inc.
Visitar el sitio del socio
Códec de software

VOCAL-3P-DSPVOIPCODECS — Códecs de tecnologías vocales DSP VoIP

With over 25 years of assembly and C code development, VOCAL modular software suite is available for a wide variety of TI DSPs. Products include ATAs, VoIP servers and gateways, HPNA-based IPBXs, video surveillance, voice and video conferencing, voice and data RF devices, RoIP gateways, secure (...)
Desde: VOCAL Technologies, Ltd.
Visitar el sitio del socio
Modelo de simulación

C6742 ZCE BSDL Model (Rev. B)

SPRM367B.ZIP (17 KB) - BSDL Model
Descargar
Modelo de simulación

C6742 ZCE IBIS Model (Rev. B)

SPRM368B.ZIP (120 KB) - IBIS Model
Descargar
Modelo de simulación

C6742 ZWT BSDL Model (Rev. B)

SPRM364B.ZIP (17 KB) - BSDL Model
Descargar
Modelo de simulación

C6742 ZWT IBIS Model (Rev. C)

SPRM365C.ZIP (121 KB) - IBIS Model
Descargar
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
NFBGA (ZWT) 361 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

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