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Módulos de alimentación (inductor integrado)

TPS81256

ACTIVO

Módulo convertidor de impulso de alta eficiencia de 3 W, solución de potencia integrada, en encapsul

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TPS81256

ACTIVO
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Detalles del producto

Rating Catalog Operating temperature range (°C) -40 to 125 Topology Boost Type Module Iout (max) (A) 0.7 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 5 Vout (max) (V) 5 Features Enable, Input/Output Isolation, Synchronous Rectification
Rating Catalog Operating temperature range (°C) -40 to 125 Topology Boost Type Module Iout (max) (A) 0.7 Vin (min) (V) 2.5 Vin (max) (V) 5.5 Vout (min) (V) 5 Vout (max) (V) 5 Features Enable, Input/Output Isolation, Synchronous Rectification
USIP (SIP) 9 See data sheet
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging
  • 91% Efficiency at 4MHz Operation
  • Wide VIN Range From 2.5V to 5.5V
  • IOUT ≥550mA at VOUT = 5.0V, VIN ≥3.3V
  • Fixed Output Voltage 5.0V
  • ±2% Total DC Voltage Accuracy
  • 43µA Supply Current
  • Best-in-Class Line and Load Transient
  • VIN ≥ VOUT Operation
  • Low-Ripple Light-Load PFM Mode
  • True Load Disconnect During Shutdown
  • Thermal Shutdown and Overload Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <9mm2
  • 9-Pin MicroSiP Packaging

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS81256 device is a complete MicroSiP DC/DC step-up power solution intended for battery-powered portable applications. Included in the package are the switching regulator, inductor and input/output capacitors. Only a tiny additional output capacitor is required to finish the design.

The TPS81256 is based on a high-frequency synchronous step-up DC/DC converter optimized for battery-powered portable applications.

The DC/DC converter operates at a regulated 4-MHz switching frequency and enters power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the supply current to 43µA (typical) during light load operation. Intended for low-power applications, the TPS81256 supports more than 3W output power over a full Li-Ion battery voltage range. Input current in shutdown mode is less than 1µA (typical), which maximizes battery life.

The TPS81256 offers a very small solution size of less than 9mm2 due to minimum amount of external components. The solution is packaged in a compact (2.6mm x 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.
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Documentación técnica

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* Data sheet TPS81256 3-W, High Efficiency Step-Up Converter In MicroSiP Packaging datasheet (Rev. D) PDF | HTML 02 feb 2018
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 14 oct 2021
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 16 jun 2021
Selection guide Power Management Guide 2018 (Rev. R) 25 jun 2018
EVM User's guide TPS8125xEVM 13 abr 2012

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

TPS81256EVM-121 — Módulo de evaluación de convertidor escalonado de alta eficiencia de 3 W en encapsulado MicroSIP™

The TPS81256EVM-121 enables test and evaluation of Texas Instruments' TPS81256 devices, a series of 4.5-MHz, step-up DC-DC converters. This user's guide includes EVM specifications, a schematic diagram, a bill of materials, and board layout images. The TPS81256 device is an ideal power-supply (...)

Guía del usuario: PDF
No disponible en TI.com
Modelo de simulación

TPS81256 TINA-TI Transient Reference Design

SLVM726.TSC (115 KB) - TINA-TI Reference Design
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Modelo de simulación

TPS81256 TINA-TI Transient Spice Model

SLVM725.ZIP (52 KB) - TINA-TI Spice Model
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Modelo de simulación

TPS81256 Unencrypted PSpice Transient Model Package (Rev. A)

SLVM607A.ZIP (46 KB) - PSpice Model
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Diseños de referencia

TIDA-00554 — Espectrómetro DLP Ultra-mobile NIR para análisis químico portátil con conectividad Bluetooth

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
USIP (SIP) 9 Ultra Librarian
Se aplican los Términos y condiciones estándar de TI para los elementos de evaluación.

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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