ESD752
- Robust surge protection:
- IEC 61000-4-5 (8/20 µs): 5.7 A or 2.5 A
- IEC 61000-4-2 level 4 ESD protection:
- ±30-kV or ±20-kV contact discharge
- ±30-kV or ±20-kV air-gap discharge
- 24 V working voltage
- Bidirectional ESD protection
- 2-channel device provides complete ESD and surge protection with single component
- Low clamping voltage protects downstream components
- I/O capacitance = 3 pF or 1.7 pF (typical)
- SOT-23 (DBZ) small, standard, common footprint
- SOT-323 / SC-70 (DCK) very small, standard, space saving, common footprint
- Leaded packages used for automatic optical inspection (AOI)
The ESD752 and ESD762 are bidirectional ESD protection diodes for USB power delivery (USB-PD) and industrial interfaces. The ESD752 and ESD762 are rated to dissipate contact ESD that meets or exceeds the maximum level specified in the IEC 61000-4-2 level 4 standard (±30-kV or ±20-kV contact and ±30-kV or ±20-kV airgap). The low dynamic resistance and low clamping voltage enables system level protection against transient events. This protection is key because industrial systems require a high level of robustness and reliability.
These devices feature a low IO capacitance per channel and a pin-out to suit two IO lines from damage caused by electrostatic discharge (ESD) and other transients. The IPP = 5.7 A (8/20 µs surge waveform) capability of the ESD752 makes it suitable for protecting USB VBUS against transient surge events as well as industrial I/O lines. Additionally, the 3 pF or 1.7 pF line capacitance of the ESD752 and ESD762 are suitable for protecting the slower speed signals for USB power delivery and IO signals for industrial applications.
The ESD752 and ESD762 are offered in two leaded packages for easy flow through routing.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | ESD752 and ESD762 24-V, 2-Channel, ESD Protection With 5.7 A of 8/20 µsSurge Protection in a SOT-23 and SOT-323 / SC-70 Package datasheet (Rev. B) | PDF | HTML | 2022/11/22 |
| Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024/01/11 | |
| Selection guide | System-Level ESD Protection Guide (Rev. D) | 2022/09/07 | ||
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ESDEVM — ESD 평가 모듈
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SOT-23 (DBZ) | 3 | Ultra Librarian |
| SOT-SC70 (DCK) | 3 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.