ESDS304
- IEC 61000-4-2 level 4 ESD protection:
- ±30kV contact discharge
- ±30kV air gap discharge
- IEC 61000-4-4 EFT protection:
- 80 A (5/50ns)
- IEC 61000-4-5 surge protection:
- 12A (8/20µs)
- Low surge clamping voltage 6V at 12A Ipp
- IO capacitance:
- 2.3pF (typical)
- DC breakdown voltage: 4.5V (minimum)
- Ultra low leakage current: 3nA (typical)
- Supports high speed interfaces up to 1 Gbps
- Industrial temperature range: –40°C to +125°C
- Easy flow-through routing package (ESDS302)
The ESDS302, ESDS304 devices are uni-directional TVS ESD protection diode array in two and four channel configurations respectively, for Ethernet and USB surge protection up to 12A (8/20µs). The ESDS302, ESDS304 devices are rated to dissipate ESD strikes up to 30kV per the IEC 61000-4-2 international standard (> Level 4).
The devices features a 2.3pF IO capacitance per channel making it an excellent choice for protecting high-speed interfaces such as Ethernet™ 1G and USB 2.0. The low dynamic resistance and low clamping voltage provides system level protection against transient events.
The ESDS302, ESDS304 devices are offered in the industry standard 5-pin SOT23 packages.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ESDS30x Data-Line Surge and ESD Protection Devices for High Speed Interfaces datasheet (Rev. B) | PDF | HTML | 2024/01/31 |
Application note | ESD and Surge Protection for USB Interfaces (Rev. B) | PDF | HTML | 2024/01/11 | |
Application brief | ESD Protection for GPIO | PDF | HTML | 2024/01/08 | |
Application note | Capacitance Requirements for High Speed Signals (Rev. A) | PDF | HTML | 2023/08/21 | |
Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 2022/08/18 | |
Application brief | Protecting I/O modules from surge events | 2019/02/04 | ||
White paper | Demystifying surge protection | 2018/11/06 | ||
Application brief | Choosing the Correct Models for ESD Devices | 2018/05/11 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
ESDEVM — ESD 평가 모듈
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.