HD3SS3411
- Compatible with Multiple Interface Standards
Including FPD Link, LVDS, PCIE Gen II, III, XAUI,
and USB3.1 - Operates up to 10 Gbps
- Wide –3 dB Differential BW of ∼ 7.5 GHz
- Excellent Dynamic Characteristics (at 4 GHz)
- Insertion Loss = –1.1 dB
- Return Loss = –11.3 dB
- Off Isolation = –19 dB
- Bidirectional "Mux/De-Mux" Differential Switch
- Supports Common Mode Voltage 0 V to 2 V
- Single Supply Voltage VCC of 3.3 V ±10%
- Industrial Temperature Range of –40°C to 105°C
The HD3SS3411 is a high-speed bi-directional passive switch in multiplexer or demultiplexer configurations. Based on control pin SEL, the device provides switching of differential channels between Port B to Port A or Port C to Port A.
The HD3SS3411 is a generic analog differential passive switch that can work for any high speed interface application as long as it is biased at a common mode voltage range of 0 V to 2 V and has differential signaling with differential amplitude up to 1800 mVpp. The device employs adaptive tracking that ensures the channel remains unchanged for entire common mode voltage range.
Excellent dynamic characteristics of the device allow high speed switching with minimum
attenuation to the signal eye diagram with little added jitter. It consumes < 2 mW of power when
operational and has a shutdown mode exercisable by OEn pin resulting
< 2 µW.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | HD3SS3411 One Channel Differential 2:1 Mux/Demux datasheet | PDF | HTML | 2015/11/10 |
| * | Radiation & reliability report | PCI-e Reference Clock Measurement with Multiplexers | PDF | HTML | 2022/06/29 |
| Application note | Passive Mux Selection Based On Bandwidth > Ron | 2019/09/11 | ||
| Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018/06/14 | ||
| EVM User's guide | HD3SS3411 EVM User's Guide | 2015/06/16 |
설계 및 개발
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TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| WQFN (RWA) | 14 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.