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비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
ISO7330-Q1
- Signaling Rate: 25 Mbps
- Integrated Noise Filter on the Inputs
- Default Output and Options
- Low Power Consumption: Typical ICC per Channel at 1 Mbps:
- ISO7330: 1 mA (5-V Supplies),
0.8 mA (3.3-V Supplies) - ISO7331: 1.4 mA (5-V Supplies),
1 mA (3.3-V Supplies)
- ISO7330: 1 mA (5-V Supplies),
- Low Propagation Delay: 32 ns
Typical (5-V Supplies) - Operates from 3.3 V and 5-V Supplies
- 3.3-V and 5-V Level Translation
- 70-kV/μs Transient Immunity,
Typical (5-V Supplies) - Robust Electromagnetic Compatibility (EMC)
- System-level ESD, EFT, and Surge Immunity
- Low Emissions
- Wide Body SOIC-16 Package
- Isolation Barrier Life: > 25 Years
- Safety and Regulatory Approvals:
- 4242-VPK Isolation per DIN V VDE V 0884-10 and DIN EN 61010-1
- 3000-VRMS Isolation for 1 minute per UL 1577
- CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 61010-1 End Equipment Standards
- CQC Certification per GB4943.1-2011
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The ISO733x family of devices provides galvanic isolation up to 3000 VRMS for 1 minute per UL 1577 and 4242 VPK per VDE V 0884-10. These devices have three isolated channels comprised of logic input and output buffers separated by a silicon dioxide (SiO2) insulation barrier.
The ISO7330 has all three channels in the same direction while ISO7331 has two channels in forward and one channel in reverse direction. See the section for further details.
Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The ISO733x family of devices has integrated noise filter for harsh industrial environment where short noise pulses may be present at the device input pins. The ISO733x family of devices has TTL input thresholds and operates from 3-V to 5.5-V supply levels. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO733x family of devices has been significantly enhanced to enable system-level ESD, EFT, Surge and Emissions compliance.
For all available packages, see the orderable addendum at the end of the datasheet.기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | ISO733x-Q1 Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet | PDF | HTML | 2015/11/16 |
Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024/01/31 | ||
White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) | PDF | HTML | 2023/09/07 | |
Certificate | CQC Certificate for ISOxxDWx (Rev. J) | 2023/03/27 | ||
Certificate | CSA Certificate for ISO73xxDW | 2023/02/22 | ||
Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) | 2022/08/05 | ||
White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021/11/16 | ||
White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021/06/11 | |
Application brief | How to Replace Optocouplers with Digital Isolators in Standard Interface Circuit (Rev. A) | PDF | HTML | 2021/05/19 | |
EVM User's guide | Universal Digital Isolator Evaluation Module | PDF | HTML | 2021/03/04 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
DIGI-ISO-EVM — 범용 디지털 아이솔레이터 평가 모듈
DIGI-ISO-EVM은 5가지 패키지(8핀 네로우 바디 SOIC(D), 8핀 와이드 바디 SOIC(DWV), 16핀 와이드 바디 SOIC(DW), 16핀 울트라 와이드 바디 SOIC(DWW), 16핀 QSOP(DBQ) 패키지)에서 TI 싱글 채널, 듀얼 채널, 트리플 채널, 쿼드 채널 또는 6채널 디지털 절연기 장치를 평가하는 데 사용되는 평가 모듈(EVM)입니다. EVM에는 최소한의 외부 구성품으로 장치를 평가할 수 있는 충분한 Berg 핀 옵션이 있습니다.
ISO7310C-EVM — 단일 채널 디지털 아이솔레이터 평가 모듈
The ISO7310C-EVM evaluation module (EVM) helps you evaluate device performance, supporting the fast development and analysis of isolated systems. This EVM board supports evaluation of any of our single-channel or dual-channel digital isolators in an 8-pin SOIC package.
The ISO7310C digital isolator (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치