PGA300
- Analog features:
- Analog front-end for resistive bridge sensors
- Accommodates sensor sensitivities from 1 mV/V to 135 mV/V
- On-chip temperature sensor
- Programmable gain
- 16-bit sigma-delta analog-to-digital converter for signal channel
- 16-bit sigma-delta analog-to-digital converter for temperature channel
- 14-bit output DAC
- Digital Features:
- <0.1% FSO accuracy across temperature
- System response time <220 µs
- Third-order temperature and nonlinearity compensation
- Diagnostic functions
- Integrated EEPROM for device operation, calibration data, and user data
- Peripheral features:
- One-wire interface enables communication through the power-supply pin
- 4-mA to 20-mA current-loop output
- Ratiometric and absolute voltage output
- Power supply:
- On-chip power management accepts wide power-supply voltage from 3.3 V to 30 V
- Integrated reverse voltage protection circuit
- Industrial temperature range: –40°C to +150°C
The PGA300 provides an interface for piezoresistive and strain-gauge pressure-sense elements. The device is a full system-on-chip (SoC) solution that incorporates a programmable analog front-end (AFE), ADC, and digital signal processing that enable direct connection to the sense element. Further, the PGA300 includes integrated voltage regulators and an oscillator, thus minimizing the number of external components. The device achieves high accuracy by employing third-order temperature and nonlinearity compensation. External communication is achieved by using a one-wire serial interface (OWI) through the power-supply pin in order to simplify the system calibration process. An Integrated DAC supports absolute-voltage, ratiometric-voltage, and 4-mA to
20-mA current-loop outputs.
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PGA900 TINA-TI Reference Design, Current Mode
PGA900 TINA-TI Reference Design, Voltage Mode
TIDA-00788 — 산업용 전류 출력 압력 센서 트랜스미터, IEC61000-4 테스트를 거친 레퍼런스 디자인
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
VQFN (RHH) | 36 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.