SN74AUC2G66

Name: SN74AUC2G66
Brand: TI
SKU: SN74AUC2G66
Price: 0.143 USD

활성

2.5V, 1:1(SPST), 2채널 아날로그 스위치

지금 주문

데이터 시트

document-pdfAcrobat SN74AUC2G66 datasheet (Rev. A) (영어)

SN74AUC2G66

활성

데이터 시트

지금 주문

제품 상세 정보

Configuration

1:1 SPST

Number of channels

Power supply voltage - single (V)

0.8, 1.2, 1.8, 2.5

Protocols

Analog

Ron (typ) (Ω)

CON (typ) (pF)

ON-state leakage current (max) (µA)

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (mA)

Rating

Catalog

Drain supply voltage (max) (V)

2.7

Supply voltage (max) (V)

2.7

Configuration

1:1 SPST

Number of channels

Power supply voltage - single (V)

0.8, 1.2, 1.8, 2.5

Protocols

Analog

Ron (typ) (Ω)

CON (typ) (pF)

ON-state leakage current (max) (µA)

Bandwidth (MHz)

500

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (mA)

Rating

Catalog

Drain supply voltage (max) (V)

2.7

Supply voltage (max) (V)

2.7

DSBGA (YZP)

2.8125 mm² 2.25 x 1.25

SSOP (DCT)

11.8 mm² 2.95 x 4

VSSOP (DCU)

6.2 mm² 2 x 3.1

Available in the Texas Instruments NanoFree™ Package
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Max t_pd of 0.5 ns at 1.8 V
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

Available in the Texas Instruments NanoFree™ Package
Operates at 0.8 V to 2.7 V
Sub-1-V Operable
Max t_pd of 0.5 ns at 1.8 V
Low Power Consumption, 10 µA at 2.7 V
High On-Off Output Voltage Ratio
High Degree of Linearity
Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.

This dual analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC operation.

The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

This dual analog switch is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.1-V to 2.7-V V_CC operation.

The SN74AUC2G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 2.7-V (peak) to be transmitted in either direction.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

filter

기타 아날로그 스위치 및 멀티플렉서 찾기

다운로드 스크립트와 함께 비디오 보기 동영상

기술 자료

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=TI에서 선정한 이 제품의 인기 문서

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19개 모두 보기

	유형	직함		날짜
*	Data sheet	SN74AUC2G66 datasheet (Rev. A)		2007/01/15
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	2022/06/02
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	2021/12/01
	Selection guide	Little Logic Guide 2018 (Rev. G)		2018/07/06
	Selection guide	Logic Guide (Rev. AB)		2017/06/12
	Application note	How to Select Little Logic (Rev. A)		2016/07/26
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		2015/12/02
	User guide	LOGIC Pocket Data Book (Rev. B)		2007/01/16
	Product overview	Design Summary for WCSP Little Logic (Rev. B)		2004/11/04
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		2004/07/08
	Application note	Selecting the Right Level Translation Solution (Rev. A)		2004/06/22
	User guide	Signal Switch Data Book (Rev. A)		2003/11/14
	Application note	Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices		2003/03/21
	User guide	AUC Data Book, January 2003 (Rev. A)		2003/01/01
	Application note	Texas Instruments Little Logic Application Report		2002/11/01
	Application note	TI IBIS File Creation, Validation, and Distribution Processes		2002/08/29
	More literature	Standard Linear & Logic for PCs, Servers & Motherboards		2002/06/13
	More literature	STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS		2002/03/27
	More literature	AUC Product Brochure (Rev. A)		2002/03/18

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

DIP-ADAPTER-EVM — DIP 어댑터 평가 모듈

소형 표면 실장 IC(집적 회로)와 쉽고 빠르며 경제적인 방식으로 인터페이싱하는 방법을 제공하는 DIP 어댑터 평가 모듈(DIP-ADAPTER-EVM)로 연산 증폭기 프로토타이핑 및 테스트 속도를 높이세요. 제품에 포함된 Samtec 터미널 스트립을 사용하여 지원되는 연산 증폭기를 연결하거나 기존 회로에 직접 연결할 수 있습니다.

DIP 어댑터 EVM 키트는 다음을 포함해 가장 널리 사용되는 6개의 업계 표준 패키지를 지원합니다.

D 및 U(SOIC-8)
PW(TSSOP-8)
DGK(MSOP-8, VSSOP-8)
(...)

사용 설명서: PDF

TI.com에서 구매 불가

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

사용 설명서: PDF

TI.com에서 구매 불가

인터페이스 어댑터

LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.

사용 설명서: PDF