제품 상세 정보

Local sensor accuracy (max) 0.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, I3C Supply voltage (max) (V) 1.98 Features Error Check, JEDEC JESD30201 Supply current (max) (µA) 9.1 Temp resolution (max) (bps) 11 Remote channels (#) 0 Addresses 2 Rating Catalog
Local sensor accuracy (max) 0.5 Type Local Operating temperature range (°C) -40 to 125 Supply voltage (min) (V) 1.7 Interface type I2C, I3C Supply voltage (max) (V) 1.98 Features Error Check, JEDEC JESD30201 Supply current (max) (µA) 9.1 Temp resolution (max) (bps) 11 Remote channels (#) 0 Addresses 2 Rating Catalog
DSBGA (YAH) 6 1.099584 mm² 1.328 x 0.828
  • Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
  • Exceeds JEDEC temperature accuracy specification:
    • ±0.25°C typical
    • ±0.5°C maximum (+75°C to +95°C)
    • ±0.75°C maximum (–40°C to +125°C)
  • Operating temperature range: –40°C to +125°C
  • Low power consumption:
    • 8.3-µA typical average quiescent current
    • 4.0-µA typical standby current
  • I/O power supply of 1 V
  • Core power supply of 1.8 V
  • Two wire serial bus interface (I 2C and I3C basic operation modes)
  • Up to 12.5-MHz data transfer rate in I3C basic mode
  • In Band Interrupt (IBI) for alerting host
  • Parity error check function for host writes
  • Packet error check function for host read and writes
  • 11-bit resolution: 0.25°C (1 LSB)
  • Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch
  • Supports JEDEC JESD302-1 DDR5 Grade B temperature sensor
  • Exceeds JEDEC temperature accuracy specification:
    • ±0.25°C typical
    • ±0.5°C maximum (+75°C to +95°C)
    • ±0.75°C maximum (–40°C to +125°C)
  • Operating temperature range: –40°C to +125°C
  • Low power consumption:
    • 8.3-µA typical average quiescent current
    • 4.0-µA typical standby current
  • I/O power supply of 1 V
  • Core power supply of 1.8 V
  • Two wire serial bus interface (I 2C and I3C basic operation modes)
  • Up to 12.5-MHz data transfer rate in I3C basic mode
  • In Band Interrupt (IBI) for alerting host
  • Parity error check function for host writes
  • Packet error check function for host read and writes
  • 11-bit resolution: 0.25°C (1 LSB)
  • Standard 6-ball DSBGA (WCSP) package with 0.5-mm pitch

The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.

The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.

The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.

The TMP139 is a high-accuracy temperature sensor with an I 2C / I3C compliant digital interface supporting In Band Interrupts (IBI). Supporting the interface requirements of JEDEC JESD302-1 for Grade-B devices, the TMP139 exceeds the temperature accuracy requirements of the specification, enabling higher performance DDR5 memory modules. Available in a compact 6-ball DSBGA package, TMP139 is designed for high-speed, high-accuracy and low-power thermal monitoring applications.

The TMP139 has a typical accuracy of ±0.25°C over the entire temperature range from –40°C to +125 °C and offers an on-chip 11-bit analog-to-digital converter (ADC) providing a temperature resolution of 0.25°C.

The TMP139 is designed to operate from a core power supply of 1.8 V and I/O power supply of 1 V, with a low typical average quiescent current of 8.3 µA when performing conversions every 125 ms.

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유형 직함 날짜
* Data sheet TMP139 0.5°C Accuracy, JEDEC DDR5 Grade B, Digital Temperature Sensor With I2C and I3C Interface datasheet (Rev. C) PDF | HTML 2023/05/04
Application brief Enhance Thermal Sensing Performance With I3C Bus PDF | HTML 2021/12/22
Application note TMP139 Breakout Board Overview PDF | HTML 2020/12/23

설계 및 개발

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거버(Gerber) 파일

TMP139YAH Breakout Design Files

SNIC016.ZIP (2096 KB)
패키지 CAD 기호, 풋프린트 및 3D 모델
DSBGA (YAH) 6 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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