TMUX1133
- Single supply range: 1.08V to 5.5V
- Dual supply range: ±2.75V
- Low leakage current: 3pA
- Low charge injection: -1pC
- Low on-resistance: 2Ω
- -40°C to +125°C operating temperature
- 1.8V logic compatible
- Fail-safe logic
- Rail to rail operation
- Bidirectional signal path
- Break-before-make switching
- ESD protection HBM: 2000V
The TMUX113x devices are precision complementary metal-oxide semiconductor (CMOS) switches with multiple channels. The TMUX1133 is a 2:1, single-pole double-throw (SPDT), configuration with three independently controlled channels and an EN pin to enable or disable all three switches. The TMUX1134 contains four independently controlled SPDT switches. Wide operating supply of 1.08V to 5.5V, or ±2.75V dual supply, allows for use in a broad array of applications from medical equipment to industrial systems. The device supports bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins ranging from VSS to VDD. For single supply applications VSS must be connected to GND.
All logic inputs have 1.8V logic compatible thresholds, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
The TMUX113x devices are part of the precision switches and multiplexers family. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications. A low supply current of 8nA enables use in portable applications.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMUX113x 5V, Low-Leakage-Current, 2:1 (SPDT), 3 or 4-Channel Precision Switches datasheet (Rev. B) | PDF | HTML | 2024/01/31 |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 |
설계 및 개발
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LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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