TMUX4157N
- Negative Voltage Support: -4 V to -12 V
- Rail-to-Rail Operation
- Bidirectional Signal Path
- 1.8 V Logic Compatible
- Fail-Safe Logic
- High Continuous Current Support: 150 mA
- Low On-Resistance: 1.8 Ω
- -55°C to +125°C Operating Temperature
- Break-Before-Make Switching
- ESD Protection HBM: 2000 V
The TMUX4157N is a general purpose 2:1, single-pole double-throw (SPDT), switch that supports a negative supply rail only. The supply voltage can range from -4 V to -12 V and the device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VSS. The state of the select pin (SEL) controls which of the two sources pins are connected to the drain pin.
While TMUX4157N supports negative voltages on the supply pin and signal path, the logic input pin is controlled with a positive voltage to allow interfacing with typical control logic circuitry such as a GPIO signal. The logic input pin has 1.8 V logic compatible thresholds and can operate as high as 5.5 for added system flexibility. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
Fast transition times and high continuous current through the switch make the TMUX4157N well suited for applications where the system needs to quickly switch between two different voltage inputs.
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기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMUX4157N -12 V Low RON, 2:1 (SPDT) Negative Voltage Switch with 1.8-V Logic Control datasheet (Rev. A) | PDF | HTML | 2021/03/26 |
Technical article | Protecting your RF amplifier stage with analog switches | PDF | HTML | 2020/02/19 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOT-SC70 (DCK) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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