제품 상세 정보

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 4.1 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 17 Bandwidth (MHz) 380 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-5 Protocols Analog Ron (typ) (Ω) 125 CON (typ) (pF) 4.1 ON-state leakage current (max) (µA) 0.0005 Supply current (typ) (µA) 17 Bandwidth (MHz) 380 Operating temperature range (°C) -40 to 125 Features Break-before-make, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 30 Rating Catalog Drain supply voltage (max) (V) 16.5 Supply voltage (max) (V) 33 Negative rail supply voltage (max) (V) -5
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RTE) 16 9 mm² 3 x 3
  • Wide Supply Range: ±5 V to ±17 V (dual),
    10 V to 17 V (single)
  • Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
  • Low On-Capacitance: 4.2 pF
  • Low Input Leakage: 0.5 pA
  • Low Charge Injection: 0.6 pC
  • Rail-to-Rail Operation
  • Low On-Resistance: 120 Ω
  • Fast Switch Turn-On Time: 66 ns
  • Break-Before-Make Switching (TMUX6113)
  • EN Pin Connectable to VDD
  • Low Supply Current: 17 µA
  • Human Body Model (HBM) ESD Protection: ± 2 kV on All Pins
  • Industry-Standard TSSOP and smaller WQFN Packages
  • Wide Supply Range: ±5 V to ±17 V (dual),
    10 V to 17 V (single)
  • Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
  • Low On-Capacitance: 4.2 pF
  • Low Input Leakage: 0.5 pA
  • Low Charge Injection: 0.6 pC
  • Rail-to-Rail Operation
  • Low On-Resistance: 120 Ω
  • Fast Switch Turn-On Time: 66 ns
  • Break-Before-Make Switching (TMUX6113)
  • EN Pin Connectable to VDD
  • Low Supply Current: 17 µA
  • Human Body Model (HBM) ESD Protection: ± 2 kV on All Pins
  • Industry-Standard TSSOP and smaller WQFN Packages

The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.

The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.

The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.

The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.

The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.

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관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
TMUX6213 활성 1.8V 로직 제어를 지원하는 36V 낮은 Ron, 1:1, 4채널, 멀티플렉서 Pin-to-pin upgrade with improved performance
TMUX7213 활성 1.8V 로직(로직 로우+하이)을 지원하는 44V, 낮은 RON, 1:1(SPST), 4채널 정밀 멀티플렉서 Pin-to-pin upgrade with improved performance

기술 자료

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
6개 모두 보기
유형 직함 날짜
* Data sheet TMUX611x ±17-V, Low-capacitance, Low-leakage-current, Precision, Quad SPST Switches datasheet (Rev. E) PDF | HTML 2019/12/13
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 2022/06/02
Application note Guarding in Multiplexer Applications PDF | HTML 2022/05/13
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 2021/12/01
Application brief Improve Stability Issues with Low Con Multiplexers (Rev. A) 2018/12/10
Application note System Level Protection for High Voltage Analog Multiplexers 2017/01/03

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

TMUX6113 IBIS Model

SCDM202.ZIP (14 KB) - IBIS Model
패키지 CAD 기호, 풋프린트 및 3D 모델
TSSOP (PW) 16 Ultra Librarian
WQFN (RTE) 16 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

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