TPA2012D2
- Output Power By Package:
- WQFN:
- 2.1 W/Ch Into 4 Ω at 5 V
- 1.4 W/Ch Into 8 Ω at 5 V
- 720 mW/Ch Into 8 Ω at 3.6 V
- DSBGA:
- 1.2 W/Ch Into 4 Ω at 5 V
(Thermally Limited) - 1.3 W/Ch Into 8 Ω at 5 V
- 720 mW/Ch Into 8 Ω at 3.6 V
- 1.2 W/Ch Into 4 Ω at 5 V
- WQFN:
- Only Two External Components Required
- Power Supply Range: 2.5 V to 5.5 V
- Independent Shutdown Control for Each Channel
- Selectable Gain of 6, 12, 18, and 24 dB
- Internal Pulldown Resistor on Shutdown Pins
- High PSRR: 77 dB at 217 Hz
- Fast Start-Up Time (3.5 ms)
- Low Supply Current
- Low Shutdown Current
- Short-Circuit and Thermal Protection
- Space-Saving Packages
- 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
- 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™
The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.
The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.
The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPA2012D2 2.1-W/Channel Stereo Filter-Free Class-D Audio Power Amplifier datasheet (Rev. F) | PDF | HTML | 2017/03/14 |
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019/08/26 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019/06/27 | ||
| Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013/05/01 | ||
| More literature | TPA2012D2_NanoEVM_ Schematic | 2007/02/13 | ||
| More literature | TPA2012D2_NanoEVM_OV | 2007/01/29 | ||
| Application note | Measuring Class-D Amplifiers for Audio Speaker Overstress Testing | 2005/10/28 | ||
| User guide | TPA2012D2EVM - User Guide (Rev. A) | 2005/04/07 |
설계 및 개발
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| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
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| WQFN (RTJ) | 20 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.