TPS22913
- Integrated Single Load Switch
- Four Pin Wafer-Chip-Scale Package (Nom)
- 0.9 mm × 0.9 mm, 0.5-mm Pitch, 0.5-mm Height (YZV)
- Input Voltage Range: 1.4 V to 5.5 V
- Low ON-Resistance
- rON = 60 mΩ at VIN = 5 V
- rON = 61 mΩ at VIN = 3.3 V
- rON = 74 mΩ at VIN = 1.8 V
- rON = 84 mΩ at VIN = 1.5 V
- 2-A Maximum Continuous Switch Current
- Low Threshold Control Input
- Controlled Slew-rate
- Under-Voltage Lock Out
- Full-Time Reverse Current Protection
- Quick Output Discharge Transistor (TPS22913B/C Devices)
The TPS22910A, TPS22912C, and TPS22913B/C are small, low rON load switches with controlled turn on. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.4 V to 5.5 V. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage GPIO control signals.
The TPS22910A, TPS22912C, and TPS22913B/C devices provide reverse current protection in ON and OFF states. An internal reverse voltage comparator disables the power-switch when the output voltage (VOUT) is driven higher than the input voltage (VIN), by VRCP, to quickly (10 µs typ) stop the flow of current towards the input side of the switch. Reverse current protection is always active, even when the power-switch is disabled. Additionally, under-voltage lockout (UVLO) protection turns the switch off if the input voltage is too low.
The TPS22913B/C contains a 150-Ω on-chip load resistor for quick output discharge when the switch is turned off.
This family of devices have various slew rate options to avoid inrush current (see for details), are available in an ultra-small, space-saving 4-pin WCSP packages, and are characterized for operation over the free-air temperature range of –40°C to 85°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPS2291xx Ultra-small, Low On Resistance Load Switch With Controlled Turn-on datasheet (Rev. F) | PDF | HTML | 2015/01/07 |
| E-book | 11 Ways to Protect Your Power Path | 2019/07/03 | ||
| Application note | Load Switch Thermal Considerations (Rev. A) | 2018/10/11 | ||
| Application note | Basics of Load Switches (Rev. A) | 2018/09/05 | ||
| Selection guide | Power Management Guide 2018 (Rev. R) | 2018/06/25 | ||
| Application note | Selecting a Load Switch to Replace a Discrete Solution | 2017/04/30 | ||
| Application note | Timing of Load Switches | 2017/04/27 | ||
| Application note | Reverse Current Protection in Load Switches | 2016/05/19 | ||
| Application note | Managing Inrush Current (Rev. A) | 2015/05/28 | ||
| EVM User's guide | TPS22910-13 EVM User's Guide (Rev. A) | 2012/01/09 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
BOOST5545ULP — C5545 부스터 팩
The C5545 Booster Pack is a small form factor, low-cost rapid development platform which includes all the hardware and software needed to evaluate the C553x and C5545 DSP families. The C553x and C5545 ultra-low-power (ULP) DSP are the industry’s lowest-cost and lowest power 16-bit DSP. The (...)
EVMK2GX — 66AK2Gx 1GHz 평가 모듈
The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)
EVMK2GXS — 66AK2Gx(K2G) 1GHz 높은 보안 평가 모듈
The K2G 1GHz High Secure Evaluation Module (EVM) enables developers to start evaluating and testing the programming of the high secure developmental version of the 66AK2Gx processor, and to accelerate the next stage of secure boot product development of audio and industrial real (...)
TPS22913B Unencrytped PSpice Transient Model Package (Rev. A)
TPS22913C Unencrypted PSpice Transient Model Package (Rev. A)
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TIDEP0081 — ADC32RF80에 66AK2L06 JESD204B 연결을 사용하여 광대역 리시버 설계 레퍼런스 디자인
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YZV) | 4 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.