TPSM53602
- Functional Safety-Capable
- 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
- 85-mm2 solution size (single sided)
- Low EMI: meets CISPR11 radiated emissions
- Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
- Standard footprint: single large thermal pad and all pins accessible from perimeter
- Input voltage range: 3.8 V to 36 V
- Output voltage range: 1 V to 7 V
- Efficiency up to 95%
- Power-good flag
- Precision enable
- Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
- Operating IC junction range: –40°C to +125°C
- Operating ambient range: –40°C to +105°C
- Shock and vibration tested to Mil-STD-883D
- Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
- Create a custom design using the TPSM53602 with the WEBENCH Power Designer
- Download the EVM Design Files for fast board design
The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.
The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TPSM53602 36-V Input, 2-A Power Module in Enhanced HotRod™ QFN Package datasheet (Rev. B) | PDF | HTML | 2021/09/30 |
Functional safety information | TPSM53602 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA | PDF | HTML | 2021/08/24 | |
Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020/03/05 | ||
EVM User's guide | Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) | 2019/12/13 | ||
White paper | Enabling Small, Cool and Quiet Power Modules with Enhanced HotRod™ QFN Packaging | 2019/11/19 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPSM53602EVM — 소형 패키지의 3.8V~36V, 2A 스텝다운 전원 모듈 평가 보드
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
B3QFN (RDA) | 15 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치