TS5A3359
- Isolation in power-down mode, VCC = 0
- Specified break-before-make switching
- Low ON-state resistance (1 Ω)
- Control inputs are 5.5 V tolerant
- Low charge injection (5 pC VCC = 1.8 V)
- Excellent ON-state resistance matching
- Low total harmonic distortion (THD)
- 1.65 V to 5.5 V single-supply operation
- Latch-up performance exceeds 100 mA per JESD 78, Class II
- ESD performance tested per JESD 22
- 2000-V human-body model (A114-B, Class II)
- 1000-V charged-device model (C101)
The TS5A3359 device is a bidirectional, single channel, single-pole triple-throw (SP3T) analog switch that is designed to operate from 1.65 V to 5.5 V. This device provides a signal switching solution while maintaining excellent signal integrity, which makes the TS5A3359 suitable for a wide range of applications in various markets including personal electronics, test and measurement equipment, and portable instrumentation. The device maintains the signal integrity by its low ON-state resistance, excellent ON-state resistance matching, and total harmonic distortion (THD) performance. To prevent signal distortion during the transferring of a signal from one channel to another, the TS5A3359 device also has a specified break-before-make feature. The device consumes very low power and provides isolation when VCC = 0.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TS5A3359 1-Ω SP3T Bidirectional Analog Switch 5-V/3.3-V Single-Channel 3:1 Multiplexer and Demultiplexer datasheet (Rev. F) | PDF | HTML | 2021/12/09 |
Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021/01/06 | |
Application note | Preventing Excess Power Consumption on Analog Switches | 2008/07/03 | ||
Application note | Using ADS8411 in a Multiplexed Analog Input Application (Rev. A) | 2006/02/15 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 |
설계 및 개발
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The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YZP) | 8 | Ultra Librarian |
VSSOP (DCU) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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