TS5V330C
- Low Differential Gain and Phase
(Typical DG = 0.24%, Typical DP = 0.039°) - Wide Bandwidth (Typical BW > 288 MHz)
- Low Cross-Talk (Typical XTALK = –87 dB)
- Low Power Consumption
(Maximum ICC = 3 µA) - Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low ON-State Resistance (Typical rON = 3
)
- VCC Operating Range From 4.5 V to 5.5 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Provide Undershoot Clamp Diode
- Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- Suitable for Both RGB and Composite Video Switching
The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input. The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance state exists between the D and S ports.
Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth and low cross talk which makes it suitable for high frequency video applications. The device can be used for RGB and composite video switching applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
기술 자료
설계 및 개발
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LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
SSOP (DBQ) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치