TS5V522C
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- High Bandwidth, 380MHZ (typ) RGB Switching
- Low ON-State Resistance (ron) Characteristics (ron =3 Ω Typical)
- Low Input/Output Capacitance Minimizes Loading and Signal Distortion
(CIO(OFF) = 8pF Typical) - Undershoot Clamp Diodes on Data and Control Inputs.
- Low Power Consumption (Icc = 3µA Max.)
- Vcc Operation Range from 4V to 5.5V
- Data I/Os Support 0 to 5-V Signaling Levels
(0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 4V) - Allow to pull up resistor up to 5V on the I/O
- Ioff Supports Live Insertion, Partial Power Down Mode,
and Back Drive Protection - Latch-Up Performance Exceeds 100Ma Per JESD 78, Class II.
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
- APPLICATIONS
- Digital and Analog Signal Interface
- Audio and Video Signal Interface
- High Speed Signal Bus Exchange
- Bus Isolation, Interleaving
- Notebook Computer Graphics Control
The TS5V522C is high bandwidth analog switches offering a 2:2 dual-graphics crossover solution for VGA signal switching. The device is designed for switching between 2 VGA sources to either of the two destinations within a laptop computer. The TS5V522C integrates 5 very high-frequency 380Mhz (typ) SPDT switches for RGB signals, 2 pairs of level-translating buffer for the HSYNC and VSYNC lines, and integrated ESD protection. The 5 crossover switches can be controlled by either 5V or 3.3V TTL control signals.
The TS5V522C would bypass the VGA analog signal to destination with less distortions. DDC Channel (SCA, SCL) may require to +5Vopen drain level at the VGA connector and it may require a pull up resistor on the destination side. Active undershoot-protection circuitry on the data ports of the TS5V522C provide protection for undershoots up to -2V by sensing an undershoot event and ensuring that the switch remains in the proper off state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pull up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 5V, 5-BITS VIDEO EXCHANGE SWITCH FOR DUAL VGA SOURCE TO SINK, TS5V522C datasheet | 2011/03/29 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | 2008/07/03 | ||
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004/07/08 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| SSOP (DBQ) | 24 | Ultra Librarian |
| TSSOP (PW) | 24 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치