The DP83867 device is a robust, low power, fully featured Physical Layer transceiver with integrated PMD sublayers to support 10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols. Optimized for ESD protection, the DP83867 exceeds 8kV IEC 61000-4-2 (direct contact).
The DP83867 is designed for easy implementation of 10/100/1000Mbps Ethernet LANs. It interfaces directly to twisted pair media through an external transformer. This device interfaces directly to the MAC layer through Reduced GMII (RGMII) or embedded clock Serial GMII (SGMII).
The DP83867 provides precision clock synchronization, including a synchronous Ethernet clock output. It has low latency and provides IEEE 1588 Start of Frame Detection.
Designed for low power, the DP83867 consumes only 457mW under full operating power. Wake-on-LAN can be used to lower system power consumption.
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The DP83867ERGZ-R-EVM supports 1000/100/10BASE and is compliant with the IEEE 802.3 standard. This reference design supports the RGMII MAC interface.
The DP83867ERGZ-R-EVM evaluation module (EVM) for the DP83867 device includes 3 on-board status LEDs and 5-V connectors with (...)
The DP83867ERGZ-S-EVM supports 1000/100/10BASE and is compliant with the IEEE 802.3 standard. This reference design supports SGMII MAC interface.
The DP83867 EVM includes three onboard status LEDs, 5V connectors with onboard LDOs, and is JTAG accessible. The DP83867 EVM is capable of providing a (...)
Congatec 的 STDA4 SMARC 模組是基於 TDA4VM 應用處理器和 DRA829J 網路處理器。
該模組旨在利用異構 SoC 架構，包括雙 Arm® Cortex®-A72、DSP 和用於深度學習 (NPU) 和多媒體 (GPU) 的加速器、Arm® Cortex®-R5F MCU，以減輕即時通訊和安全功能的負擔。此模組專為在惡劣環境應用中實現高可靠性而設計，適用的工業溫度範圍為 -40°C 至 +85°C。
不同的產品型號分別在 conga-STDA4 模組上搭載了 TDA4VM 或 DRA829J，並提供可擴充大小的 LPDDR4 RAM 和 eMMC 5.1 NAND (...)
ASPEED 乙太網路 PHY EVM 是子卡，可用於連接至 ASPEED 的 AST2600 評估板 (EVB)，以展示如何在電路板管理控制器 (BMC) 系統中使用 DP83867 和 DP83869 乙太網路 PHY。EVM 包含四個 PHY，每個 PHY 可提供 10/100/1000Mbps 的資料速率。
The USB-2-MDIO software tool lets Texas Instruments' Ethernet PHYs access the MDIO status and device control registers. The USB-2-MDIO tool includes a LaunchPad™ Development kit for TI's MSP430™ MCUs that is interfaced with a lightweight GUI. The (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| VQFN (RGZ) | 48 | Ultra Librarian |
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。