現在提供此產品的更新版本
引腳對引腳且具備與所比較裝置相同的功能
ISO7331-Q1
- Signaling Rate: 25 Mbps
- Integrated Noise Filter on the Inputs
- Default Output and Options
- Low Power Consumption: Typical ICC per Channel at 1 Mbps:
- ISO7330: 1 mA (5-V Supplies),
0.8 mA (3.3-V Supplies) - ISO7331: 1.4 mA (5-V Supplies),
1 mA (3.3-V Supplies)
- ISO7330: 1 mA (5-V Supplies),
- Low Propagation Delay: 32 ns
Typical (5-V Supplies) - Operates from 3.3 V and 5-V Supplies
- 3.3-V and 5-V Level Translation
- 70-kV/μs Transient Immunity,
Typical (5-V Supplies) - Robust Electromagnetic Compatibility (EMC)
- System-level ESD, EFT, and Surge Immunity
- Low Emissions
- Wide Body SOIC-16 Package
- Isolation Barrier Life: > 25 Years
- Safety and Regulatory Approvals:
- 4242-VPK Isolation per DIN V VDE V 0884-10 and DIN EN 61010-1
- 3000-VRMS Isolation for 1 minute per UL 1577
- CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 61010-1 End Equipment Standards
- CQC Certification per GB4943.1-2011
All trademarks are the property of their respective owners.
The ISO733x family of devices provides galvanic isolation up to 3000 VRMS for 1 minute per UL 1577 and 4242 VPK per VDE V 0884-10. These devices have three isolated channels comprised of logic input and output buffers separated by a silicon dioxide (SiO2) insulation barrier.
The ISO7330 has all three channels in the same direction while ISO7331 has two channels in forward and one channel in reverse direction. See the section for further details.
Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. The ISO733x family of devices has integrated noise filter for harsh industrial environment where short noise pulses may be present at the device input pins. The ISO733x family of devices has TTL input thresholds and operates from 3-V to 5.5-V supply levels. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO733x family of devices has been significantly enhanced to enable system-level ESD, EFT, Surge and Emissions compliance.
For all available packages, see the orderable addendum at the end of the datasheet.技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | ISO733x-Q1 Robust EMC, Low Power, Triple-Channel Digital Isolators datasheet | PDF | HTML | 2015年 11月 16日 |
Certificate | VDE Certificate for Basic Isolation for DIN EN IEC 60747-17 (Rev. W) | 2024年 1月 31日 | ||
White paper | Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) | PDF | HTML | 2023年 9月 7日 | |
Certificate | CQC Certificate for ISOxxDWx (Rev. J) | 2023年 3月 27日 | ||
Certificate | CSA Certificate for ISO73xxDW | 2023年 2月 22日 | ||
Certificate | UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) | 2022年 8月 5日 | ||
White paper | Why are Digital Isolators Certified to Meet Electrical Equipment Standards? | 2021年 11月 16日 | ||
White paper | Distance Through Insulation: How Digital Isolators Meet Certification Requiremen | PDF | HTML | 2021年 6月 11日 | |
Application brief | How to Replace Optocouplers with Digital Isolators in Standard Interface Circuit (Rev. A) | PDF | HTML | 2021年 5月 19日 | |
EVM User's guide | Universal Digital Isolator Evaluation Module | PDF | HTML | 2021年 3月 4日 |
設計與開發
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DIGI-ISO-EVM — 通用數位隔離器評估模組
DIGI-ISO-EVM 是一款評估模組 (EVM),可評估任何 TI 單通道、雙通道、三通道、四通道或六通道數位隔離器裝置,並提供五種不同封裝 - 8 接腳窄體 SOIC (D)、8 接腳寬體 SOIC (DWV)、16 接腳寬體 SOIC (DWW)、16 接腳超寬體 SOIC (DWW) 和 16 接腳 (DBQ) 封裝。EVM 具備足夠 Berg 接腳選項,可用於評估具最少外部零組件的裝置。
ISO7310C-EVM — 單通道數位隔離器評估模組
The ISO7310C-EVM evaluation module (EVM) helps you evaluate device performance, supporting the fast development and analysis of isolated systems. This EVM board supports evaluation of any of our single-channel or dual-channel digital isolators in an 8-pin SOIC package.
The ISO7310C digital isolator (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (DW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點