LM35
- Calibrated Directly in Celsius (Centigrade)
- Linear + 10-mV/°C Scale Factor
- 0.5°C Ensured Accuracy (at 25°C)
- Rated for Full −55°C to 150°C Range
- Suitable for Remote Applications
- Low-Cost Due to Wafer-Level Trimming
- Operates From 4 V to 30 V
- Less Than 60-µA Current Drain
- Low Self-Heating, 0.08°C in Still Air
- Non-Linearity Only ±¼°C Typical
- Low-Impedance Output, 0.1 Ω for 1-mA Load
The LM35 series are precision integrated-circuit temperature devices with an output voltage linearly-proportional to the Centigrade temperature. The LM35 device has an advantage over linear temperature sensors calibrated in Kelvin, as the user is not required to subtract a large constant voltage from the output to obtain convenient Centigrade scaling. The LM35 device does not require any external calibration or trimming to provide typical accuracies of ±¼°C at room temperature and ±¾°C over a full −55°C to 150°C temperature range. Lower cost is assured by trimming and calibration at the wafer level. The low-output impedance, linear output, and precise inherent calibration of the LM35 device makes interfacing to readout or control circuitry especially easy. The device is used with single power supplies, or with plus and minus supplies. As the LM35 device draws only 60 µA from the supply, it has very low self-heating of less than 0.1°C in still air. The LM35 device is rated to operate over a −55°C to 150°C temperature range, while the LM35C device is rated for a −40°C to 110°C range (−10° with improved accuracy). The LM35-series devices are available packaged in hermetic TO transistor packages, while the LM35C, LM35CA, and LM35D devices are available in the plastic TO-92 transistor package. The LM35D device is available in an 8-lead surface-mount small-outline package and a plastic TO-220 package.
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
TO-220 (NEB) | 3 | Ultra Librarian |
TO-92 (LP) | 3 | Ultra Librarian |
TO-CAN (NDV) | 3 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點