現在提供此產品的更新版本
功能相同,但引腳輸出與所比較的裝置不同
LMC7101
- Tiny 5-Pin SOT-23 Package Saves Space—Typical
Circuit Layouts Take Half the
Space of 8-Pin SOIC Designs - Ensured Specifications at 2.7-V, 3-V, 5-V, 15-V
Supplies - Typical Supply Current 0.5 mA at 5 V
- Typical Total Harmonic Distortion of 0.01% at 5 V
- 1-MHz Gain Bandwidth
- Similar to Popular LMC6482 and LMC6484
- Rail-to-Rail Input and Output
- Temperature Range –40°C to 125°C
(LMC7101Q-Q1)
The LMC7101 device is a high-performance CMOS operational amplifier available in the space-saving 5-pin SOT-23 tiny package. This makes the LMC7101 ideal for space- and weight-critical designs. The performance is similar to a single amplifier of the LMC6482 and LMC6484 types, with rail-to-rail input and output, high open-loop gain, low distortion, and low-supply currents.
The main benefits of the tiny package are most apparent in small portable electronic devices, such as mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The tiny amplifiers can be placed on a board where they are needed, thus simplifying board layout.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMC7101, LMC7101Q-Q1 Tiny Low-Power Operational Amplifier With Rail-to-Rail Input and Output datasheet (Rev. G) | PDF | HTML | 2015年 9月 30日 |
Circuit design | Inverting Summer Circuit (Rev. C) | PDF | HTML | 2021年 2月 1日 | |
Technical article | How to design a simple two-phase current-sharing synchronous buck regulator using | PDF | HTML | 2017年 11月 3日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 |
設計與開發
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- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
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ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060023 — 反相加法器電路
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點