TLV2471

現行

單路、6-V、2.8-MHz、RRIO 運算放大器

現在提供此產品的更新版本

open-in-new 比較替代產品
可直接投入的替代產品,相較於所比較的裝置,具備升級功能
OPA310 現行 單路、5.5-V、3-MHz、高輸出電流 (150 mA)、快速關機 (1 μs) 運算放大器 Higher GBW (3MHz), better accuracy (1.4mV Vos max), higher output current (150mA)

產品詳細資料

Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 2.8 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 2.2 Iq per channel (typ) (mA) 0.6 Vn at 1 kHz (typ) (nV√Hz) 15 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 0.4 Input bias current (max) (pA) 50 CMRR (typ) (dB) 84 Iout (typ) (A) 0.09 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.07 Output swing headroom (to positive supply) (typ) (V) -0.04
Number of channels 1 Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) 6 Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) 2.7 Rail-to-rail In, Out GBW (typ) (MHz) 2.8 Slew rate (typ) (V/µs) 1.5 Vos (offset voltage at 25°C) (max) (mV) 2.2 Iq per channel (typ) (mA) 0.6 Vn at 1 kHz (typ) (nV√Hz) 15 Rating Catalog Operating temperature range (°C) -40 to 125 Offset drift (typ) (µV/°C) 0.4 Input bias current (max) (pA) 50 CMRR (typ) (dB) 84 Iout (typ) (A) 0.09 Architecture CMOS Input common mode headroom (to negative supply) (typ) (V) 0 Input common mode headroom (to positive supply) (typ) (V) 0 Output swing headroom (to negative supply) (typ) (V) 0.07 Output swing headroom (to positive supply) (typ) (V) -0.04
PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (D) 8 29.4 mm² 4.9 x 6 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8
  • CMOS Rail-To-Rail Input/Output
  • Input Bias Current: 2.5pA
  • Low Supply Current: 600µA/Channel
  • Ultra-Low Power Shutdown Mode:
    • IDD(SHDN): 350nA/ch at 3V
    • IDD(SHDN): 1000nA/ch at 5V
  • Gain-Bandwidth Product: 2.8MHz
  • High Output Drive Capability:
    • ±10mA at 180mV
    • ±35mA at 500mV
  • Input Offset Voltage: 250µV (typ)
  • Supply Voltage Range: 2.7V to 6V
  • Ultra-Small Packaging
    • SOT23-5 or -6 (TLV2470/1)
    • MSOP-8 or -10 (TLV2472/3)

PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.

  • CMOS Rail-To-Rail Input/Output
  • Input Bias Current: 2.5pA
  • Low Supply Current: 600µA/Channel
  • Ultra-Low Power Shutdown Mode:
    • IDD(SHDN): 350nA/ch at 3V
    • IDD(SHDN): 1000nA/ch at 5V
  • Gain-Bandwidth Product: 2.8MHz
  • High Output Drive Capability:
    • ±10mA at 180mV
    • ±35mA at 500mV
  • Input Offset Voltage: 250µV (typ)
  • Supply Voltage Range: 2.7V to 6V
  • Ultra-Small Packaging
    • SOT23-5 or -6 (TLV2470/1)
    • MSOP-8 or -10 (TLV2472/3)

PowerPAD is a trademark of Texas Instruments.
Microsim PARTS is a trademark of MicroSim Corporation.
Microsim PSpice is a registered trademark of MicroSim Corporation.
All other trademarks are the property of their respective owners.

The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.

The TLV247x is a family of CMOS rail-to-rail input/ output operational amplifiers that establishes a new performance point for supply current versus ac performance. These devices consume just 600µA/channel while offering 2.8MHz of gain-bandwidth product. Along with increased ac performance, the amplifier provides high output drive capability, solving a major shortcoming of older micropower operational amplifiers. The TLV247x can swing to within 180mV of each supply rail while driving a 10mA load. For non-RRO applications, the TLV247x can supply ±35mA at 500mV off the rail. Both the inputs and outputs swing rail-to-rail for increased dynamic range in low-voltage applications. This performance makes the TLV247x family ideal for sensor interface, portable medical equipment, and other data acquisition circuits.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4
類型 標題 日期
* Data sheet Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet (Rev. E) 2007年 7月 3日
Application note Conditioning a Switch-mode Power Supply Current Signal Using TI Op Amps (Rev. A) PDF | HTML 2021年 6月 11日
E-book The Signal e-book: A compendium of blog posts on op amp design topics 2017年 3月 28日
Application note Use of Rail-to-Rail Operational Amplifiers (Rev. A) 1999年 12月 22日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

AMP-PDK-EVM — 放大器性能開發套件評估模組

放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。

AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:

  • D (SOIC-8 和 SOIC-14)
  • PW (TSSOP-14)
  • DGK (VSSOP-8)
  • DBV (SOT23-5 和 SOT23-6)
  • DCK (SC70-5 和 SC70-6)
使用指南: PDF | HTML
開發板

DIP-ADAPTER-EVM — DIP 轉接器評估模組

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

使用指南: PDF
TI.com 無法提供
開發板

DIYAMP-EVM — 通用自製 (DIY) 放大器電路評估模組

The DIYAMP-EVM is a unique evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling you to quickly evaluate design concepts and verify simulations. It is available in three industry-standard packages (SC70, SOT23, SOIC) and (...)

使用指南: PDF | HTML
模擬型號

TLV247xA PSpice 5V Supply Voltage Model

SLOJ018.ZIP (0 KB) - PSpice Model
計算工具

ANALOG-ENGINEER-CALC — 類比工程師計算機

The Analog Engineer’s Calculator is designed to speed up many of the repetitive calculations that analog circuit design engineers use on a regular basis. This PC-based tool provides a graphical interface with a list of various common calculations ranging from setting op-amp gain with feedback (...)
設計工具

CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器

此設計可反轉輸入訊號 VIN,並使用 1000 V/V 或 60 dB 訊號增益。具有 T 回饋網路的反相放大器可在沒有較小 R4 值或超大回饋電阻器值的情況下獲得高增益。
設計工具

CIRCUIT060015 — 可調式參考電壓電路

此電路結合反相及非反相放大器,讓參考電壓可從負輸入電壓向上調整至輸入電壓。可加入增益以提高最大負參考位準。
設計工具

CIRCUIT060074 — 具有比較器電路的高壓側電流感測

此高壓側電流感測解決方案使用一個具有軌對軌輸入共模範圍的比較器,若負載電流上升到 1 A 以上,便在比較器輸出 (COMP OUT) 建立過電流警示 (OC 警示) 訊號。此實作中的 OC 訊號為低電位作動。因此當超過 1-A 閾值時,比較器輸出會變低。實作磁滯後會在負載電流降低至 0.5 A (減少 50%) 時,讓 OC-Alert 返回邏輯高狀態。此電路利用開漏輸出比較器,為控制數位邏輯輸入針腳而進行電平轉換輸出高邏輯電平。對於需要驅動 MOSFET 開關閘極的應用,建議使用具推挽輸出的比較器。
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
PDIP (P) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian
SOT-23 (DBV) 5 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片