TLV342
- 1.8-V and 5-V Performance
- Low Offset (A Grade)
- 1.25 mV Maximum (25°C)
- 1.7 mV Maximum (–40°C to 125°C)
- Rail-to-Rail Output Swing
- Wide Common-Mode Input Voltage Range: –0.2 V
to (V+ – 0.5 V) - Input Bias Current: 1 pA (Typical)
- Input Offset Voltage: 0.3 mV (Typical)
- Low Supply Current: 70 µA/Channel
- Low Shutdown Current:
10 pA (Typical) Per Channel - Gain Bandwidth: 2.3 MHz (Typical)
- Slew Rate: 0.9 V/µs (Typical)
- Turnon Time From Shutdown: 5 µs (Typical)
- Input Referred Voltage Noise (at 10 kHz):
20 nV/√Hz - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (HBM)
- 750-V Charged-device model (CDM)
The TLV34xx devices are single and dual CMOS operational amplifiers, respectively, with
low-voltage, low-power, and rail-to-rail output swing capabilities. The PMOS input stage offers an
ultra-low input bias current of 1 pA (typical) and an offset voltage of
0.3 mV (typical). For applications requiring excellent dc precision, the A grade (TLV34xA)
has a low offset voltage of 1.25 mV (maximum) at 25°C.
These single-supply amplifiers are designed specifically for ultra-low-voltage (1.5 V to 5 V) operation, with a common-mode input voltage range that typically extends from 0.2 V to 0.5 V from the positive supply rail.
The TLV341 (single) and TLV342 (dual) in the RUG package also offer a shutdown (SHDN) pin that can be used to disable the device. In shutdown mode, the supply current is reduced to 45 pA (typical). Offered in both the SOT-23 and smaller SC70 packages, the TLV341 is suitable for the most space-constrained applications. The dual TLV342 is offered in the standard SOIC, VSSOP, and X2QFN packages.
An extended industrial temperature range from 40°C to 125°C makes the TLV34xx suitable in a wide variety of commercial and industrial applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TLV34xx Low-Voltage Rail-to-Rail Output CMOS Operational Amplifiers With Shutdown datasheet (Rev. D) | PDF | HTML | 2016年 4月 29日 |
Application note | Op Amp ESD Protection Structures (Rev. A) | PDF | HTML | 2023年 1月 24日 | |
User guide | SMALL-AMP-DIP Evaluation Module (EVM) (Rev. A) | 2021年 7月 30日 | ||
Application note | Conditioning a Switch-mode Power Supply Current Signal Using TI Op Amps (Rev. A) | PDF | HTML | 2021年 6月 11日 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | Use of Rail-to-Rail Operational Amplifiers (Rev. A) | 1999年 12月 22日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
DIP-ADAPTER-EVM — DIP 轉接器評估模組
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
The (...)
SMALL-AMP-DIP-EVM — 適用於採用小尺寸封裝之運算放大器的評估模組
SMALL-AMP-DIP-EVM 提供快速簡易方式,與許多業界標準小型封裝進行介接,因而加速小型封裝運算放大器原型設計。SMALL-AMP-DIP-EVM 支援八個小型封裝選項,包括 DPW-5 (X2SON)、DSG-8 (WSON)、DCN-8 (SOT)、DDF-8 (SOT)、RUG-10 (X2QFN)、RUC-14 (X2QFN)、RGY-14 (VQFN) 和 RTE-16 (WQFN)。
ANALOG-ENGINEER-CALC — 類比工程師計算機
CIRCUIT060013 — 具有 T 網路回饋電路的反相放大器
CIRCUIT060074 — 具有比較器電路的高壓側電流感測
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
X2QFN (RUG) | 10 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點