TMUX6112
- Wide Supply Range: ±5 V to ±17 V (dual),
10 V to 17 V (single) - Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 4.2 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: 0.6 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Fast Switch Turn-On Time: 66 ns
- Break-Before-Make Switching (TMUX6113)
- EN Pin Connectable to VDD
- Low Supply Current: 17 µA
- Human Body Model (HBM) ESD Protection: ± 2 kV on All Pins
- Industry-Standard TSSOP and smaller WQFN Packages
The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
WQFN (RTE) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。