TMUX6112
- Wide Supply Range: ±5 V to ±17 V (dual),
10 V to 17 V (single) - Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 4.2 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: 0.6 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Fast Switch Turn-On Time: 66 ns
- Break-Before-Make Switching (TMUX6113)
- EN Pin Connectable to VDD
- Low Supply Current: 17 µA
- Human Body Model (HBM) ESD Protection: ± 2 kV on All Pins
- Industry-Standard TSSOP and smaller WQFN Packages
The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.
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技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX611x ±17-V, Low-capacitance, Low-leakage-current, Precision, Quad SPST Switches datasheet (Rev. E) | PDF | HTML | 2019年 12月 13日 |
| White paper | Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) | PDF | HTML | 2024年 4月 30日 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022年 6月 2日 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022年 5月 13日 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021年 12月 1日 | |
| Application brief | Improving Signal Measurement Accuracy in Automated Test Equipment | PDF | HTML | 2020年 10月 2日 | |
| Application brief | Choosing the Right Multiplexer for a Discrete Programmable Gain Amplifier (PGA) | PDF | HTML | 2020年 9月 29日 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 2018年 12月 10日 | ||
| Application note | System Level Protection for High Voltage Analog Multiplexers | 2017年 1月 3日 |
設計與開發
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LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
| WQFN (RTE) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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