TPS61170-Q1
- Qualified for automotive applications
- Functional Safety-Capable
- 3-V to 18-V Input voltage range
- High output voltage: up to 38 V
- 1.2-A Integrated switch
- 1.2-MHz Fixed switching frequency
- 12 V at 300 mA and 24 V at 150 mA from 5-V Input (typical)
- Up to 93% efficiency
- On-the-fly output voltage reprogramming
- Skip-switching cycle for output regulation at light load
- Built-in soft start
- 6-Pin, 2-mm × 2-mm SON package
The TPS61170-Q1 is a monolithic, high-voltage switching regulator with integrated 1.2-A, 40-V power MOSFET. The device can be configured in several standard switching-regulator topologies, including boost and SEPIC. The device has a wide input-voltage range to support applications with input voltage from multicell batteries or regulated 5-V, 12-V power rails.
The TPS61170-Q1 operates at a 1.2-MHz switching frequency, allowing the use of low-profile inductors and low-value ceramic input and output capacitors. External loop compensation components give the user flexibility to optimize loop compensation and transient response. The device has built-in protection features, such as pulse-by-pulse overcurrent limit, soft start, and thermal shutdown.
The FB pin regulates to a reference voltage of
1.229 V. The reference voltage can be lowered using a 1-wire digital interface (EasyScale™ protocol) through the CTRL pin. Alternatively, a pulse width-modulation (PWM) signal can be applied to the CTRL pin. The duty cycle of the signal reduces the feedback reference voltage proportionally.
The TPS61170-Q1 is available in a 6-pin 2-mm ×
2-mm SON package, allowing a compact power-supply solution.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TPS61170-Q1 1.2-A High-Voltage Boost Converter in 2-mm × 2-mm SON Package datasheet (Rev. B) | PDF | HTML | 2020年 6月 10日 |
| Application note | Design of Insulation Monitoring Device (IMD) in On-board Charger System With Active Single-Switch Architecture | PDF | HTML | 2026年 1月 30日 | |
| White paper | A Comparative Analysis of Insulation Monitoring Device (IMD) Architectures in Bidirectional Onboard Chargers | PDF | HTML | 2025年 10月 21日 | |
| Application note | QFN and SON PCB Attachment (Rev. C) | PDF | HTML | 2023年 12月 6日 | |
| Functional safety information | TPS61170-Q1 Functional Safety, FIT Rate, and Failure Mode Distribution | 2020年 5月 22日 | ||
| Application note | Performing Accurate PFM Mode Efficiency Measurements (Rev. A) | 2018年 12月 11日 | ||
| Analog Design Journal | Design considerations for a resistive feedback divider in a DC/DC converter | 2012年 4月 26日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WSON (DRV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。