UCC27714
- High-Side, Low-Side Configuration, with Independent Inputs
- Fully Operational up to 600 V (HS Pin)
- Floating Channel Designed for Bootstrap Operation
- Peak Output Current Capability of 4-A Sink 4-A Source at VDD = 15 V
- Best-In-Class Propagation Delay (125-ns Maximum)
- Best-In-Class Delay Matching (20-ns Maximum)
- TTL and CMOS Compatible Input Logic
- VDD Bias Supply Range of 10 V to 20 V
- Bias UVLO Protection for Both Channels
- Rail-to-Rail Drive
- Robust Operation Under Negative Voltage Transients
- High dv/dt Immunity (HS Pin)
- Separated Grounds for Logic (VSS) and Driver (COM) with Capability to Sustain Voltage Difference
- Optional Enable Function (Pin 4)
- Outputs Held in LOW when Inputs Floating
- Inputs and Enable Pin Voltage Levels Not Restricted by VDD Pin Bias Supply Voltage
- High and Low Voltage Pins Separated for Maximum Creepage and Clearance
- Negative Voltage Handling Capability on Input and Enable Pins
UCC27714 is a 600-V high-side, low-side gate driver with 4-A source and 4-A sink current capability, targeted to drive power MOSFETs or IGBTs. The device comprises of one ground-referenced channel (LO) and one floating channel (HO) which is designed for operating with bootstrap supplies. The device features excellent robustness and noise immunity with capability to maintain operational logic at negative voltages of up to –8 VDC on HS pin (at VDD = 12 V).
The device accepts a wide range bias supply input from 10 V to 20 V and offers UVLO protection for both the VCC and HB bias supply pins. UCC27714 is available in SOIC-14 package and rated to operate from –40°C to 125°C.
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設計與開發
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UCC27714EVM-551 — UCC27714 600W 相移全橋轉換器評估模組
This 600W EVM was designed to demonstrate how the UCC28950 control IC, UCC27524A and UCC27714 gate drivers could be used in a phase shifted full bridge converter that achieves ZVS from 50 to 100% load.
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 14 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。