SBOS817I June   2017  – August 2021 TLV6741 , TLV6742

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information for Single Channel
    5. 7.5 Thermal Information for Dual Channel
    6. 7.6 Electrical Characteristics
    7. 7.7 TLV6741: Typical Characteristics
    8. 7.8 TLV6742: Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 THD+ Noise Performance
      2. 8.3.2 Operating Voltage
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 EMI Rejection
      5. 8.3.5 Electrical Overstress
      6. 8.3.6 Typical Specifications and Distributions
      7. 8.3.7 Shutdown Function
      8. 8.3.8 Packages With an Exposed Thermal Pad
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Single-Supply Electret Microphone Preamplifier With Speech Filter
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision H (February 2021) to Revision I (August 2021)

  • Removed preview tag from TLV6742 VSSOP in Device Information section Go
  • Removed preview tag to VSSOP (DGK) in Device Comparison Table sectionGo

Changes from Revision G (April 2020) to Revision H (February 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed preview tag from TLV6742S X2QFN in Device Information section Go
  • Removed preview note from X2QFN for TLV6742S in Pin Configuration and Functions sectionGo
  • Removed Table of TLV6741 Graphs and Table of TLV6742 Graphs tables from the Specifications sectionGo
  • Removed Related Links section from the Device and Documentation Support sectionGo

Changes from Revision F (January 2020) to Revision G (April 2020)

  • Added end equipment links in Application sectionGo
  • Deleted preview tags for TSSOP, SOT-23, WSON, and X2QFN packages in Device Information section Go
  • Deleted VSSOP (8) package in Device Information section Go
  • Added preview tag to TLV6742S X2QFN in Device Information section Go
  • Deleted VSSOP (DGK) in Device Comparison Table sectionGo
  • Added preview tag to X2QFN (RUG) in Device Comparison Table sectionGo
  • Deleted DGK package in pinout drawing for TLV6742 package in Pin Configuration and Functions sectionGo
  • Deleted DGK VSSOP in Thermal Information for Dual Channel sectionGo
  • Added  shutdown electrical characteristic informationGo
  • Deleted example layout for VSSOP-8 (DGK) package in Layout Example sectionGo

Changes from Revision E (December 2019) to Revision F (January 2020)

  • Deleted TLV6744 product folder link from the data sheet page headerGo

Changes from Revision D (January 2019) to Revision E (December 2019)

  • Added IQ definition for TLV6742 and TLV744 in Features sectionGo
  • Added EMIRR, Supply Range, IQ, and Offset Voltage Drift to Features sectionGo
  • Changed Noise Spectral Density vs Frequency plot on front page to the TLV6742 and TLV6744 noise plotGo
  • Changed wording of Description section to incorporate release of TLV6742 and TLV6744 devices Go
  • Changed TLV6742 packages in Device Information Go
  • Added Device Comparison Table sectionGo
  • Added note regarding single supply operation to Pin Functions: TLV6741 tableGo
  • Added pin out drawings for TLV6742 packages in Pin Configuration and Functions sectionGo
  • Added pin functions for TLV6742 packagesGo
  • Added X2QFN Package Drawing and Pin Functions for TLV6742S in Pin Configuration and Functions sectionGo
  • Added TLV6742 typical characteristic graphs in the Specifications sectionGo
  • Changed wording throughout Detailed Description section to incorporate addition of TLV6742 and TLV6744 devicesGo
  • Added EMI Rejection section with description information to Detailed Description sectionGo
  • Added Electrical Overstress section and diagram to Detailed Description sectionGo
  • Added Typical Specification and Distributions section to Detailed Description sectionGo
  • Added Shutdown Function section with description for TLV6742S to Detailed Description sectionGo
  • Added Packages With an Exposed Thermal Pad section to Detailed Description sectionGo
  • Changed wording in Application and Implementation section to include the addition of TLV6742 and TLV6744Go
  • Added TLV6742 and TLV6744 information to Power Supply Recommendations sectionGo
  • Added dual channel layout example in the Layout sectionGo

Changes from Revision C (October 2017) to Revision D (January 2019)

  • Changed Operating temperature from 125 to 150  in Absolute Maximum Ratings Go
  • Added Junction temperature spec to Absolute Maximum Ratings Go

Changes from Revision B (October 2017) to Revision C (October 2017)

  • Added test conditions to input offset voltage parameter in Electrical Characteristics tableGo
  • Changed typical input current noise density value from 2 fA√HZ to 23 fA√HzGo
  • Changed total supply voltage total from 5V to 5.5V in Electrical Characteristics condition statementGo
  • Deleted "Vs = 2.25 V to 5.5 V" test conditions for common-mode rejection ratio parameter in Electrical Characteristics Go
  • Deleted "CL = 0" test condition from Figure 7-25 and Figure 7-26, Figure 7-27 and Figure 7-28 Go
  • Changed voltage step from 5 V to 2 V in Figure 7-32 Go

Changes from Revision A (September 2017) to Revision B (October 2017)

  • Changed  Human-body model (HBM) value from: ±1000 to ±3000 and Charged-device mode (CDM) value from ±250 to ±1000Go

Changes from Revision * (June 2017) to Revision A (September 2017)

  • Changed device document status from: Advance Information to: Production DataGo
  • Added Typical Characteristics Go