SLVSDW6C April   2017  – April 2021 TPS7H1101A-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good (PG)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable/Disable
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Stability
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Adjustable Output Voltage (Feedback Circuit)
        2. 8.2.1.2 PCL
        3. 8.2.1.3 High-Side Current Sense
        4. 8.2.1.4 Current Foldback
        5. 8.2.1.5 Transient Response
        6. 8.2.1.6 Current Sharing
        7. 8.2.1.7 Compensation
        8. 8.2.1.8 Output Noise
        9. 8.2.1.9 Capacitors
      2. 8.2.2 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (June 2020) to Revision C (April 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added TPS7H1101AHKR/EM to Device Information tableGo

Changes from Revision A (August 2017) to Revision B (June 2020)

  • Added package weight to Device Information tableGo
  • Added note to Pin Functions table for thermal pad and lidGo
  • Added updated thermal metrics in Thermal Information tableGo
  • Changed and relaxed VCS operating rangeGo
  • Added table note for VCS Go
  • Changed CSR ratio. Added limits by temperature Go
  • Added clarification for TEN Go
  • Changed Overview section for improved clarity Go
  • Changed and clarifed VREF voltage in CSS calculation Go
  • Changed Stability applications sectionGo
  • Changed and corrected PCL section descriptionGo
  • Changed and clarified High-Side Current Sense section description Go
  • Changed and clarified Current Foldback section descriptionGo
  • Changed and improved Layout Example sectionGo

Changes from Revision * (April 2017) to Revision A (August 2017)

  • Added Bare Die Information tableGo
  • Added Bond Pad Coordinates in Microns tableGo