JAJSPG8I August   1987  – January 2023 SN65ALS176 , SN75ALS176 , SN75ALS176A , SN75ALS176B

PRODUCTION DATA  

  1. 1 特長
  2. 2 概要
  3. 3 改訂履歴
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  推奨動作条件
    3. 5.3  Thermal Information
    4. 5.4  Electrical Characteristics - Driver
    5. 5.5  Switching Characteristics - Driver
    6. 5.6  Switching Characteristics - Driver
    7. 5.7  Symbol Equivalents
    8. 5.8  Electrical Characteristics - Receiver
    9. 5.9  Switching Characteristics - Receiver
    10. 5.10 Switching Characteristics - Receiver
    11. 5.11 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|8
  • P|8
サーマルパッド・メカニカル・データ
発注情報

5.3 Thermal Information

THERMAL METRIC(1)P (PDIP)D (SOIC)
SN65 Devices		D (SOIC)
SN75 Devices		UNIT
8-Pins8-Pins

8-Pin

R θJAJunction-to-ambient thermal resistance65.7116.7110°C/W
R θJC(top)Junction-to-case thermal resistance54.756.344.1°C/W
R θJBJunction-to-board thermal resistance42.163.453.5°C/W
ψ JTJunction-to-top characterization parameter238.84.8°C/W
ψ JBJunction-to-board characterization parameter41.762.652.7°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.