JAJS253P April   2004  – August 2024 TPS2041B , TPS2042B , TPS2043B , TPS2044B , TPS2051B , TPS2052B , TPS2053B , TPS2054B

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 General Switch Catalog
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (All Devices Excluding TPS2051BDBV and TPS2052BD)
    7. 6.7 Typical Characteristics (TPS2051BDBV and TPS2052BD)
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Power Switch
      2. 8.3.2  Charge Pump
      3. 8.3.3  Driver
      4. 8.3.4  Enable ( ENx)
      5. 8.3.5  Enable (ENx)
      6. 8.3.6  Current Sense
      7. 8.3.7  Overcurrent
        1. 8.3.7.1 Overcurrent Conditions (TPS20x3BD, TPS20x4BD, and TPS20x2BDRB)
        2. 8.3.7.2 Overcurrent Conditions (TPS20x1B & TPS20x2B in D, DGN, and DBV packages)
      8. 8.3.8  Overcurrent ( OCx)
      9. 8.3.9  Thermal Sense
      10. 8.3.10 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Universal Serial Bus (USB) Applications
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application (TPS2042B)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power-Supply Considerations
          2. 9.2.1.2.2 OC Response
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Host and Self-Powered and Bus-Powered Hubs
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 USB Power-Distribution Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Generic Hot-Plug Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Undervoltage Lockout (UVLO)
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 Thermal Protection
  13. 12Device and Documentation Support
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 用語集
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.1 Layout Guidelines

  • Place the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace.
  • Placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin is recommended when large transient currents are expected on the output.
  • The PowerPAD must be directly connected to PCB ground plane using wide and short copper trace.