SFFS525A September   2022  – November 2022 UCC28C50 , UCC28C51 , UCC28C52 , UCC28C53 , UCC28C54 , UCC28C55 , UCC28C56L , UCC28C57H , UCC28C57L , UCC28C58 , UCC28C59

 

  1. 1Overview
  2. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 SOIC (8) Package
    2. 2.2 VSSOP (8) Package
  3. 3Failure Mode Distribution (FMD)
  4. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SOIC (8) and VSSOP (8) Packages
  5. 5Revision History

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the UCCx8C5x (SOIC (8) and VSSOP (8) packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • IC is connected based on the typical application design schematic in UCCx8C5xdatasheet Figure 9-3