SNIA043A july   2021  – april 2023 TMP114 , TMP144

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Heat Sink Temperature Sensor Monitoring
  5. 3Component Temperature Monitoring With Adjacent PCB Placement
  6. 4Under-Component Temperature Monitoring
    1. 4.1 Ultra-Thin Temperature Sensors
    2. 4.2 Designing an Under-Component Layout With the TMP114 Temperature Sensor
    3. 4.3 Under-Component Experimental Results
  7. 5Summary
  8. 6References
  9. 7Revision History

7 Revision History

Changes from Revision * (July 2021) to Revision A (April 2023)

  • Changes for revision A.Go
  • Added the TMP117 testing and results.Go